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Unicomp AX8300 BGA X Ray Inspection Machine With Low Test Preparation Time

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China Unicomp Technology certification
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Unicomp AX8300 BGA X Ray Inspection Machine With Low Test Preparation Time

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Large Image :  Unicomp AX8300 BGA X Ray Inspection Machine With Low Test Preparation Time

Product Details:
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX8300
Payment & Shipping Terms:
Minimum Order Quantity: 1Set
Price: can negotiate
Packaging Details: Wooden Case, Waterproof, Anti-collision
Delivery Time: 30 days
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
Detailed Product Description
Name: BGA X Ray Inspection Machine Application: SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
System Magnification: Up To 1000X Max KV/type: 110 KV(Option90 KV)/Sealed
Size: 1100(L)x1100(W)x1650(H)mm Cabinet Dimensions: 1100x1100x1650mm
High Light:

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bga x ray machine

BGA X Ray Inspection Machine with high quality X ray images Unicomp AX8300

 

 

X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer.

 

 

Model

AX8300

Max kV/type

110 kV(Option90 kV)/Sealed

Max.Electron beam power

25W(Option8W)

Focal spot size1

7μm

System magnification

Up to 1000X

Imaging system(Option)

Flat Panel Detector

Manipulator

8-axis with tilt 50 degree

Measuring volume

Max load area 300x300mm2

Max.sample weight

5kg

Monitors

22" LCD

Cabinet dimensions

1100x1100x1650mm

Weight

1700kg

Radiation safety2

<1μSv/hr(<0.1mR/hr)at the cabinet surface 5cm

Control

Keyboard/Mouse/Joystick

Automated inspection

Standard

Primary applications

Chip inspection/Electronic components/Auto parts.etc

1.Focal spot size is a variable.Please consult the unicomp

2.X-ray Safety Commitment:All x-ray machines manufactured by Unicomp Technology meet the

  FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems.The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed.5millirem/hr.2"from any external surface.Our machines are typically 15times less emission.

 

 

X-ray Inspecting Features:

 

(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.

 

(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.

 

(3) The test preparation time is greatly reduced.

 

(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.

 

(5) Double layers board and multi-layer boards only one check (with layered function).

 

(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.

 

 

Inspection Images:


 

Unicomp AX8300 BGA X Ray Inspection Machine With Low Test Preparation Time 0

Contact Details
Unicomp Technology

Contact Person: Unicomp-sales

Tel: +8613502802495

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