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Electronic Components BGA X Ray Inspection Machine

Certification
China Unicomp Technology certification
China Unicomp Technology certification
Customer Reviews
Stable product quality , reliable cooperation partner

—— Mr. Smith

Unicomp Techology is really impressive.

—— Selvam N

You are good and reliable supplier again thanks

—— Mr. Merlin Euphemia

The feedback we got from the unit we purchased is so far very good. The client is happy.

—— Mr. Nicholas

A professional service team Life-long free software upgrading Timely technical support

—— Ms Rein

We have visited Unicomp . It is big company in China . And their engineers are so professional .

—— Mr Okan

Scheduled call & visits Onsite installation, debugging and training services

—— Mrs Yulia

Nice work on the X-Ray machine!

—— Qusaay Albayati

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Electronic Components BGA X Ray Inspection Machine

Electronic Components BGA X Ray Inspection Machine
Electronic Components BGA X Ray Inspection Machine

Large Image :  Electronic Components BGA X Ray Inspection Machine

Product Details:
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: LX2000
Payment & Shipping Terms:
Minimum Order Quantity: 1Set
Price: can negotiate
Packaging Details: Wooden Case, Waterproof, Anti-collision
Delivery Time: 30 days
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
Detailed Product Description
Name: X-ray Inspection Machine Tube Voltage: 130KV
Monitor: 22"LCD Orbit Adjusting Range: 80-350mm
Weight: 2000kg Power Consumption: 2kW
High Light:

bga inspection equipment

,

bga x ray machine

Online inspection system for Checking LED Semiconductor Electronic Components

 

 

The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system.

 

 

X-ray Inspecting Features:

 

(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder

shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint

devices can also be checked by X-Ray.

 

(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such

as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.

 

(3) The test preparation time is greatly reduced.

 

(4) It can observe other means of detection can not be reliably detected defects, such as: Empty

soldering, air holes and poor molding and so on.

 

(5) Double layers board and multi-layer boards only one check (with layered function).

 

(6) Can provide relevant measurement information, used to evaluate the production process. Such as

solder paste thickness, solder joints under the amount of solder.

 

 

Training

 

Training will include:

Basic Radiation Safety.
X-Ray system control functions.
X-Ray image processing software training.
Basic X-ray signature analysis training.
Hands-on sample analysis using your typical samples.
Training certificates for all attendees.

 

 

Item Definition Specs
System Parameters Size 1385(L)x1400(W)x1620(H)mm
Weight 2000kg
Power 220AC/50Hz
Power Consumption 3.5kW
X-ray Tube Type Closed
Max.Voltage 130kV
Max.Power 40W
Spot Size 3μm
X-ray System Intensifier FPD
Monitor 22 ‘’LCD
System Magnification 200 X
Detection Region Orbit Adjusting Range 80-350mm
X-ray Leakage <1μSv/h
Control Mode CNC Motion Mode

 


Electronic Components BGA X Ray Inspection Machine 0

 

 

Contact Details
Unicomp Technology

Contact Person: Mr. James Lee

Tel: +86-13502802495

Fax: +86-755-2665-0296

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