IHDR Algorithm Enhanced BGA & PCBA X-ray Inspection UNICOMP AX8300 Ultra-Clear Defect Visualization
Product Details
pcb x ray inspection
,pcb inspection equipment
,High Resolution PCB X Ray Machine
IHDR Algorithm Enhanced BGA & PCBA X-ray Inspection UNICOMP AX8300 Ultra-Clear Defect Visualization
The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect “In Between” design that offers a solution when 90kV is not enough energy and 130kV is too much.
Using a state of the art FPD (Flat Panel Display) detection, the AX-8300 can generate extreme high magnification/resolution images that are similar to the highest resolution 90kV x-ray tubes can produce. Additionally, the AX-8300 offers 360 degree table rotation providing unlimited image views.
|
Model |
AX8300 |
|
Max kV/type |
110 kV/Sealed |
|
Max. power |
25W |
|
Min.Resolution |
5μm |
|
Geometric magnification |
48.8X |
|
Imaging system(Option) |
Flat Panel Detector |
|
Monitors |
22" LCD |
|
Dimensions |
1215x1325x1700mm |
|
Weight |
1350kg |
|
Radiation safety2 |
<1μSv/hr(<0.1mR/hr)at the cabinet surface 5cm |
|
Control |
Keyboard/Mouse/Joystick |
|
Automated inspection |
Standard |
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Primary applications |
Chip inspection/Electronic components/Auto parts.etc |
|
1.Focal spot size is a variable.Please consult the unicomp 2.X-ray Safety Commitment:All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems.The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed.5millirem/hr.2"from any external surface.Our machines are typically 15times less emission. |
|
Features:
110kV Microfocus x-ray source,
High resolution FPD
X/Y/Z/Tilt Motions (table, tube, FPD)
360° Table Rotation
Angle View up to 70 Degrees
Point and Click Location Navigation
CNC Programming for Multiple Image Inspection Routines
Max Inspection Area 360 x 340mm
Application:
1.BGA/CSP/FLIPS CHIP:
Bridging ,Voids,Opens,Expcessive/insufficient
2.QFN:Bridging,Voids,Opens,Registration
3.SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others
4.Semiconductor:
bond wire,die attach VOID ,MOLD,VOID
5.Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias
Inspection Images:
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