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5μm 110kV Sealed Tube IC Semiconductor Electronics Xray Inspection Machine AX8300 Unicomp High Precision

Basic Properties
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX8300
Trading Properties
Minimum Order Quantity: 1Set
Price: can negotiate
Payment Terms: T/T,L/C
Supply Ability: 30 sets per month
Product Summary
5μm 110kV Sealed Tube IC Semiconductor Electronics Xray Inspection Machine AX8300 Unicomp High Precision AX8300 is purpose-built to fulfill high-precision inspection needs for PCBA manufacturing. It features an innovative 110kV micro-focus X-ray source, uniquely developed to bridge the performance ...

Product Details

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Warranty: 1 Year
Product Name: AX8300
Power Supply: 220V,50Hz/60Hz 4A
Weight: 1345kg
Dimension: 1200*1285*1700(mm)
Voltage: 110kv
Product Description

5μm 110kV Sealed Tube IC Semiconductor Electronics Xray Inspection Machine AX8300 Unicomp High Precision



AX8300 is purpose-built to fulfill high-precision inspection needs for PCBA manufacturing. It features an innovative 110kV micro-focus X-ray source, uniquely developed to bridge the performance gap between standard 90kV and 130kV systems. It delivers balanced penetration power, perfectly suited for scenarios where 90kV is insufficient and 130kV is overly powerful.

Powered by a cutting-edge flat-panel detector (FPD), the AX8300 captures ultra-high-resolution images at superior magnification, achieving fine imaging quality comparable to top-tier 90kV X-ray devices. Meanwhile, the full 360° table rotation enables flexible, multi-angle observation for comprehensive internal defect detection.



Features:


110kV Microfocus x-ray source,


High resolution FPD


X/Y/Z/Tilt Motions (table, tube, FPD)


360° Table Rotation


Angle View up to 70 Degrees


Point and Click Location Navigation


CNC Programming for Multiple Image Inspection Routines


Max Inspection Area 360 x 340mm



Application:


1. BGA/CSP/FLIPS CHIP: Bridging ,Voids,Opens,Expcessive/insufficient


2. QFN: Bridging,Voids,Opens,Registration


3. SMT Standard components: QFP,SOT,SOIC,Chips,Connectors,Others


4. Semiconductor: bond wire,die attach VOID ,MOLD,VOID


5. Multi-layer board(MLB): Inner layer registration,PAD stack,blind/buried vias



Model

AX8300

Max kV/type

110 kV/Sealed

Power Consumption

900W

Max.Electron beam power

25W

Focal spot size

5μm

Geometric magnification

49.8X

Imaging system(Option)

Flat Panel Detector

Door Open

Hand-operated door

Monitor

27" HD 4Kdisplay

Dimensions

1200x1285x1700mm

Weight

1345kg

Radiation safety

<1μSv/hr(<0.1mR/hr)at the cabinet surface 5cm

Control

Keyboard/Mouse/Joystick

Automated inspection

Standard

Primary applications

Chip inspection/Electronic components/Auto parts.etc

1.Focal spot size is a variable.Please consult the unicomp

2.X-ray Safety Commitment:All x-ray machines manufactured by Unicomp Technology meet the

  FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems.The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed.5millirem/hr.2"from any external surface.Our machines are typically 15times less emission.



Inspection Images:

5μm 110kV Sealed Tube IC Semiconductor Electronics Xray Inspection Machine AX8300 Unicomp High Precision 0
 




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    United Kingdom Mar 12.2026
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