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50°Tilt Detection Wire Harness Cable Xray Inspection Machine AX8300 Unicomp Crimp Joint Void Detector

Basic Properties
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX8300
Trading Properties
Minimum Order Quantity: 1Set
Price: can negotiate
Payment Terms: T/T,L/C
Supply Ability: 30 sets per month
Product Summary
50°Tilt Detection Wire Harness Cable Xray Inspection Machine AX8300 Unicomp Crimp Joint Void Detector The AX8300 is a dedicated X-ray inspection system engineered for high-precision PCBA production. Equipped with a proprietary 110kV micro-focus X-ray tube, it fills the performance void between ...

Product Details

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Warranty: 1 Year
Product Name: AX8300
Power Supply: 220V,50Hz/60Hz 4A
Weight: 1350kg
Dimension: 1215*1325*1700(mm)
Voltage: 110kv
Product Description

50°Tilt Detection Wire Harness Cable Xray Inspection Machine AX8300 Unicomp Crimp Joint Void Detector



The AX8300 is a dedicated X-ray inspection system engineered for high-precision PCBA production. Equipped with a proprietary 110kV micro-focus X-ray tube, it fills the performance void between conventional 90kV and 130kV equipment, delivering balanced penetration ideal for applications where 90kV lacks penetration and 130kV provides excessive energy.
Integrated with advanced flat-panel detector (FPD), the unit acquires ultra-high-definition imagery under high magnification, matching the fine imaging performance of premium 90kV X-ray systems. Its 360° full rotary worktable supports flexible multi-angle viewing to thoroughly identify internal assembly defects.



Features:


110kV Microfocus x-ray source,


High resolution FPD


X/Y/Z/Tilt Motions (table, tube, FPD)


360° Table Rotation


Angle View up to 70 Degrees


Point and Click Location Navigation


CNC Programming for Multiple Image Inspection Routines


Max Inspection Area 360 x 340mm



Application:


1. BGA/CSP/FLIPS CHIP: Bridging ,Voids,Opens,Expcessive/insufficient


2. QFN: Bridging,Voids,Opens,Registration


3. SMT Standard components: QFP,SOT,SOIC,Chips,Connectors,Others


4. Semiconductor: bond wire,die attach VOID ,MOLD,VOID


5. Multi-layer board(MLB): Inner layer registration,PAD stack,blind/buried vias



Model

AX8300

Max kV/type

110 kV/Sealed

Power Consumption

900W

Max.Electron beam power

25W

Focal spot size

5μm

Geometric magnification

48.8X

Imaging system(Option)

Flat Panel Detector

Door Open

Hand-operated door

Monitor

27" HD 4Kdisplay

Dimensions

115x1325x1700mm

Weight

1350kg

Radiation safety

<1μSv/hr

Control

Keyboard/Mouse/Joystick

Automated inspection

Standard

Primary applications

Chip inspection/Electronic components/Auto parts.etc

1.Focal spot size is a variable.Please consult the unicomp

2.X-ray Safety Commitment:All x-ray machines manufactured by Unicomp Technology meet the

  FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems.The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed.5millirem/hr.2"from any external surface.Our machines are typically 15times less emission.



Inspection Images:

50°Tilt Detection Wire Harness Cable Xray Inspection Machine AX8300 Unicomp Crimp Joint Void Detector 0
 




Overall Rating
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  • J
    J*n
    United Kingdom Mar 12.2026
    ★★★★★
    ★★★★★
    Good!
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