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Unicomp X-ray system AX7900 for internal defect inspection of Electronic Components

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Unicomp X-ray system AX7900 for internal defect inspection of Electronic Components

Unicomp X-ray system AX7900 for internal defect inspection of Electronic Components
Unicomp X-ray system AX7900 for internal defect inspection of Electronic Components

Large Image :  Unicomp X-ray system AX7900 for internal defect inspection of Electronic Components

Product Details:
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX7900
Payment & Shipping Terms:
Minimum Order Quantity: 1Set
Price: can negotiate
Packaging Details: Wooden Case, Waterproof, Anti-collision
Delivery Time: 30 days
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
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Detailed Product Description
Name: Unicomp X-ray Inspection Machine Application: SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage: 80KV/90KV Industry: Electronics Industry
Size: 1100(L)x1100(W)x1500(H)mm X-ray Leakage: < 1uSv/h
Weight: 1000kg Power Consumption: 0.8KW
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Unicomp X-Ray inspection machine AX7900 for BGA inspection of Electronic Components

 

FEATURES of IC Xray machine AX7900:

  • 90KV 5μm X-ray tube, FPD Detector.
  • Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
  • Motion controls include X/Y table motion plus Z-axis tube and detector movement, ±60° tilt motion (option).
  • Multi-function DXI image processing system.
  • X/Y programming function for multiple image inspection routines
  • Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
  • BGA void/area auto-measurement plus report generation.

 

Description of IC X Ray machine AX7900:

 

90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection area 380 x 380mm, with ~300X System Magnification.

 

 

APPLICATION of IC Xray machine AX7900:

  • LED, SMT, BGA, CSP, Flip Chip Inspection.
  • Semiconductor, Packaging components, Battery Industry.
  • Electronic components, Auto parts, Photovoltaic Industry.
  • Aluminum Die Casting, Moulding Plastic.
  • Ceramics, Other Special Industries

 

Technical Specifications of AX7900

 

Item Definition Specs
System Parameters Size 1100(L)x1100(W)x1500(H)mm
Weight 1000kg
Power 220AC/50Hz
Power Consumption 0.8kW
X-ray Tube Type Closed
Max.Voltage 80kV/90kV
Max.Power 12W/8W
Spot Size 5μm/15μm
X-ray System Intensifier FPD
Monitor 22 ‘’LCD
System Magnification 160 X/360X
Detection Region Max.Loading Size 440mm x 400mm
Max.Inspection Area 420mm x 380mm
X-ray Leakage <1μSv/h

 

 

Inspection Images of IC X Ray machine AX7900:


Unicomp X-ray system AX7900 for internal defect inspection of Electronic Components 0

Tag:

x ray equipment,

electronics x ray system,

electronic inspection equipment

Contact Details
Unicomp Technology

Contact Person: Mr. James Lee

Tel: +86-13502802495

Fax: +86-755-2665-0296

Send your inquiry directly to us (0 / 3000)

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Factory Address:Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Sales office:Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
+86-755-8527-1589
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