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Electronics Benchtop X Ray Machine For PCB / BGA Connectivity And Analysis

China Unicomp Technology certification
China Unicomp Technology certification
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Stable product quality , reliable cooperation partner

—— Mr. Smith

Unicomp Techology is really impressive.

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—— Mr. Merlin Euphemia

The feedback we got from the unit we purchased is so far very good. The client is happy.

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We have visited Unicomp . It is big company in China . And their engineers are so professional .

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Electronics Benchtop X Ray Machine For PCB / BGA Connectivity And Analysis


Large Image :  Electronics Benchtop X Ray Machine For PCB / BGA Connectivity And Analysis

Product Details:
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: CX3000
Payment & Shipping Terms:
Minimum Order Quantity: 1Set
Price: can negotiate
Packaging Details: Wooden Case, Waterproof, Anti-collision
Delivery Time: 30 days
Payment Terms: T/T, L/C
Supply Ability: 30 sets per month
Detailed Product Description
Name: X-ray Inspection Machine Type: Closed
Intensifier: FDP X-ray Leakage: < 1uSv/h
X-ray Coverage: 48mm X 54mm Power Consumption: 0.5kW
High Light:

desktop x ray machine


x ray detection systems

BGA connectivity and analysis Benchtop X Ray Machine for PCB



Item Definition Specs
System Parameters Size 750(L)x570(W)x890(H)mm
Weight 300kg
Power 220AC/50Hz
Power Consumption 0.5kW
X-ray Tube Type Closed
Max.Voltage 100kV
Max.Power 200μA
Spot Size 5μm
Detector Intensifier FPD
X-ray Coverage 48mm x 54mm
Resolution 208Lp/cm
Work Station Max.Loading Size 200mm x 200mm
Max.Inspection Area 200mm x 200mm
Oblique Angle Views 360° rotary fixture (Optional)
X-ray Leakage <1μSv/h

X-ray Inspecting Features:
(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.
(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.
(3) The test preparation time is greatly reduced.
(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.
(5) Double layers board and multi-layer boards only one check (with layered function).
(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.
1.Your inquiry will be replied in 12 hours.
2.Original Manufacture to customers, with competitive price.
3.We provide one year warranty, free training and whole life technology support.
4.We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment.
5.Well-trained and Professional after-sales service team to support you.
6.Manual will package with machine . It will show you how to use machine step by step.
7.Items are only shipped after payment is received.
Inspection Images:
Electronics Benchtop X Ray Machine For PCB / BGA Connectivity And Analysis 0

Contact Details
Unicomp Technology

Contact Person: Unicomp-sales

Tel: +8613502802495

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