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EMS Semiconductor BGA X Ray Inspection Machine System AX8200 0.8kW Power Consumption

Basic Properties
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX8200
Trading Properties
Minimum Order Quantity: 1Set
Price: can negotiate
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
Product Summary
EMS Semiconductor BGA X Ray Inspection Machine System AX8200 Features: ● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera. ● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement. ● Multi-function DXI image processing system ● X/Y ...

Product Details

Highlight:

bga x ray inspection system

,

bga x ray machine

Name: BGA X Ray Inspection Machine
Application: SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Max.Power: 8W
X-Ray Leakage: < 1uSv/h
Monitor: 22"LCD
Power Consumption: 0.8kW
Product Description

EMS Semiconductor BGA X Ray Inspection Machine System AX8200

 

 

Features:
 

● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera.
 

● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement.
 

● Multi-function DXI image processing system
 

● X/Y programming function for multiple image inspection routines
 

● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X System Magnification.
 

 

Item

Definition

Specs

System Parameters

Size

1080(L)x1180(W)x1730(H)mm

Weight

1150kg

Power

220AC/50Hz

Power Consumption

0.8kW

X-ray Tube

Type

Closed

Max.Voltage

90kV/100kV

Max.Power

8W

Spot Size

5μm

X-ray System

Intensifier

4"Image Intensifier

Monitor

22"LCD

System Magnification

600x

Detection Region

Max.Loading Size

510mm x 420mm

Max.Inspection Area

435mm x 385mm

X-ray Leakage

< 1uSv/h

 
 
Full Automatic BGA Testing Procedures
 
1. A simple mouse click programming without the need for operator intervention on the component can detects each BGA automatically.
 
2. Automatic BGA test, accurately check the bridge, Welding, cold welding and void ratio of BGA.
 
3. Automatic BGA test repeatable test results in order to process control
 
4. The test results will be displayed on the screen and can be output to Excel to facilitate review and archiving
 
NC Programming
 
1.A simple mouse clicks operation write test procedures
 
2.The stage can be X, Y director positioning; X-ray tube and detector Z positioning.
 
3.Software setting voltage and current
 
4.Image settings: brightness, contrast, auto gain and exposure
 
5.The user can set the program switch pause time
 
6.Anti-collision system can meet the maximum tilt and observe objects
 
 
Inspection Images:
 
EMS Semiconductor BGA X Ray Inspection Machine System AX8200 0.8kW Power Consumption 0

 

Overall Rating
5.0
★★★★★
★★★★★
Based on 50 reviews recently
5 star
100%
4 star
0
3 star
0
2 star
0
1 star
0
All Reviews
  • T
    Tony
    Thailand Apr 15.2026
    ★★★★★
    ★★★★★
    It's useful for our product.
  • M
    Mony
    Singapore Jan 14.2026
    ★★★★★
    ★★★★★
    It is suitable for detecting various food contaminants. It can identify substances such as quartz and ceramics.
    Review image
  • S
    S*y
    Italy Nov 6.2025
    ★★★★★
    ★★★★★
    Very Clear.
    Review image
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