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Grey Unicomp X Ray Detection Equipment , BGA Void Inspection Machine 220AC / 50Hz

Basic Properties
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: LX2000
Trading Properties
Minimum Order Quantity: 1Set
Price: can negotiate
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
Product Summary
BGA voids inspecting machine Electronics X ray machine for SMT manufacturer The LX-2000 is a versatile OnLine X-ray Machine designed for automated and semi-automated analysis. In addition to the OnLine capability, the LX-2000 can also be used in a Manual mode as a process monitoring/engineering ...

Product Details

Highlight:

electronics x ray system

,

x ray equipment

Color: Grey
Name: Electronics X Ray Machine
Application: SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Max. Voltage: 90kV / 100kV
Power: 220AC/50Hz
Size: 1600(L)x1450(W)x1600(H)mm
Product Description

BGA voids inspecting machine Electronics X ray machine for SMT manufacturer

 

 

The LX-2000 is a versatile OnLine X-ray Machine designed for automated and semi-automated analysis. In addition to the OnLine capability, the LX-2000 can also be used in a Manual mode as a process monitoring/engineering workstation.

High resolution x-ray images are generated using a closed microfocus 130kV tube with leading edge FPD (Flat Panel Display) detectors. This imaging chain combination is excellent for multiple applications including; PCBA, Semiconductor, Encapsulated Components, and Solar Cell just to name a few.

 

 

OUR SERVICE

 

1. Your inquiry will be replied in 12 hours.

 

2. Original Manufacture to customers, with competitive price.

 

3. We provide one year warranty, free training and whole life technology support.

 

4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you,
and will give you the tracking NO. after shipment.

 

5. Well-trained and Professional after-sales service team to support you.

 

6. Manual will package with machine . It will show you how to use machine step by step.

 

7. Items are only shipped after payment is received.

 

 

Application:

 

1. BGA/CSP/FLIPS CHIP:
Bridging ,Voids,Opens,Expcessive/insufficient

 

2. QFN:Bridging,Voids,Opens,Registration

 

3. SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others

 

4. Semiconductor:
bond wire,die attach VOID ,MOLD,VOID

 

5. Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias

Overall Rating
5.0
★★★★★
★★★★★
Based on 50 reviews recently
5 star
100%
4 star
0
3 star
0
2 star
0
1 star
0
All Reviews
  • M
    Marek
    Hungary Feb 10.2026
    ★★★★★
    ★★★★★
    The machine is excellent, the service is satisfactory, and the technology is highly professional.
  • M
    M*k
    Albania Dec 3.2025
    ★★★★★
    ★★★★★
    good machine
  • S
    Smith
    Germany May 16.2024
    ★★★★★
    ★★★★★
    Stable product quality , reliable cooperation partner
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