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High Performance Electronics X Ray Machine , BGA Inspection Equipment Closed Tube Type

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China Unicomp Technology certification
China Unicomp Technology certification
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Stable product quality , reliable cooperation partner

—— Mr. Smith

Unicomp Techology is really impressive.

—— Selvam N

You are good and reliable supplier again thanks

—— Mr. Merlin Euphemia

The feedback we got from the unit we purchased is so far very good. The client is happy.

—— Mr. Nicholas

A professional service team Life-long free software upgrading Timely technical support

—— Ms Rein

We have visited Unicomp . It is big company in China . And their engineers are so professional .

—— Mr Okan

Scheduled call & visits Onsite installation, debugging and training services

—— Mrs Yulia

Nice work on the X-Ray machine!

—— Qusaay Albayati

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High Performance Electronics X Ray Machine , BGA Inspection Equipment Closed Tube Type

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Large Image :  High Performance Electronics X Ray Machine , BGA Inspection Equipment Closed Tube Type

Product Details:
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX8500
Payment & Shipping Terms:
Minimum Order Quantity: 1Set
Price: can negotiate
Packaging Details: Wooden Case, Waterproof, Anti-collision
Delivery Time: 30 days
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
Detailed Product Description
Name: BGA X Ray Inspection Machine Application: SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage: 100KV Max.Detection Dimension: 350x450mm
Voltage/Current: 90kv/200μA Tilt Detection Angle: 60°
High Light:

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Electronic and electrical components BGA X Ray Inspection Machine

 

 

Item Definition Specs
Motion Control System Motion Control Mode Mouse&Joystick&Keyboard
Max.Load Dimension 500x500mm
Max.Detection Dimension 350x450mm
Tilt Detection Angle 60°
X-Ray System Tube Type Closed
Voltage/Current 100kv/200μA
Focal Spot Size 5μm
FPD Detector FPD
Physical & Image Processing Parameters Length x Width x Height 1250 x 1300 x 1900 mm
Weight 1500 kg
Power 2kW
System Magnification 500 x
  Leakage Dose <1μSv/h


 


X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer.

 

 

 

X-ray Inspecting Features:

 

(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.

 

(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.

 

(3) The test preparation time is greatly reduced.

 

(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.

 

(5) Double layers board and multi-layer boards only one check (with layered function).

 

(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.

 

Inspection Images:
High Performance Electronics X Ray Machine , BGA Inspection Equipment Closed Tube Type 0

 

 

Contact Details
Unicomp Technology

Contact Person: Unicomp-sales

Tel: +8613502802495

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