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Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor

Certification
China Unicomp Technology certification
China Unicomp Technology certification
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Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor

Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor
Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor

Large Image :  Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor

Product Details:
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX8200
Payment & Shipping Terms:
Minimum Order Quantity: 1Set
Price: can negotiate
Packaging Details: Wooden Case, Waterproof, Anti-collision
Delivery Time: 30 days
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
Detailed Product Description
Name: Electronics X Ray Machine Weight: 1150kg
Tube Voltage: 100KV Max.Loading Size: 510mm X 420mm
Size: 1080(L)x1180(W)x1730(H)mm X-ray Leakage: < 1uSv/h
High Light:

electronics x ray system

,

x ray equipment

Highly flexible and cost effective electronics and semiconductor X Ray Machine

 

 

X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer.

 
 

X-ray Inspecting Features:

 

(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.

 

(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.

 

(3) The test preparation time is greatly reduced.

 

(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.

 

(5) Double layers board and multi-layer boards only one check (with layered function).

 

(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.

 

 

Item

Definition

Specs

System Parameters

Size

1080(L)x1180(W)x1730(H)mm

Weight

1150kg

Power

220AC/50Hz

Power Consumption

0.8kW

X-ray Tube

Type

Closed

Max.Voltage

90kV/100kV

Max.Power

8W

Spot Size

5μm

X-ray System

Intensifier

4"Image Intensifier

Monitor

22"LCD

System Magnification

600x

Detection Region

Max.Loading Size

510mm x 420mm

Max.Inspection Area

435mm x 385mm

X-ray Leakage

< 1uSv/h

 
 
Inspection Images:
 
Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor 0

Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor 1 AX8200.pdf

 

Contact Details
Unicomp Technology

Contact Person: Unicomp-sales

Tel: +8613502802495

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