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UNICOMP Metal X Ray Machine For BGA Connectivity And Analysis AX9100

Certification
China Unicomp Technology certification
China Unicomp Technology certification
Customer Reviews
Stable product quality , reliable cooperation partner

—— Mr. Smith

Unicomp Techology is really impressive.

—— Selvam N

You are good and reliable supplier again thanks

—— Mr. Merlin Euphemia

The feedback we got from the unit we purchased is so far very good. The client is happy.

—— Mr. Nicholas

A professional service team Life-long free software upgrading Timely technical support

—— Ms Rein

We have visited Unicomp . It is big company in China . And their engineers are so professional .

—— Mr Okan

Scheduled call & visits Onsite installation, debugging and training services

—— Mrs Yulia

Nice work on the X-Ray machine!

—— Qusaay Albayati

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UNICOMP Metal X Ray Machine For BGA Connectivity And Analysis AX9100

UNICOMP Metal X Ray Machine For BGA Connectivity And Analysis AX9100
UNICOMP Metal X Ray Machine For BGA Connectivity And Analysis AX9100

Large Image :  UNICOMP Metal X Ray Machine For BGA Connectivity And Analysis AX9100

Product Details:
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX9100
Payment & Shipping Terms:
Minimum Order Quantity: 1Set
Price: can negotiate
Packaging Details: Wooden Case, Waterproof, Anti-collision
Delivery Time: 30 days
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
Detailed Product Description
Name: X-ray Inspection Machine Max.Voltage: 130kV
Max.Power: 40W Max.Loading Size: Φ570mm
Size: 1350(L)x1250(W)x1700(H)mm Max.Inspection Area: 450mm X 450mm
High Light:

metal x ray machine

,

metal detector x ray machine

Metal X Ray Machine for BGA connectivity and analysis AX9100

 

 

Item Definition Specs
System Parameters Size 1350(L)x1250(W)x1700(H)mm
Weight 1900kg
Power 220AC/50Hz
Power Consumption 1.6kW
X-ray Tube Type Closed
Max.Voltage 130kV
Max.Power 40W
Spot Size 3μm
X-ray System Intensifier FPD
Monitor 22 ‘’LCD
System Magnification 1600 X
Detection Region Max.Loading Size Φ570mm
Max.Inspection Area 450mm x 450mm
X-ray Leakage <1μSv/h

 

 

Applications

 

Solder reflow analysis

 

BGA connectivity and analysis

 

Solder void calculation

 

Through hole measurement and inspection

 

Die attach voiding measurement

 

Ball bond analysis

 

Stitch bond analysis

 

Micro BGA / chip on chop analysis

 

Pad array analysis

 

Dry joint detection and analysis

 


Installation

 

Unicomp will provide installation and calibration service at the customers location Installation includes assistance in registering your new x-ray system with local and state agencies where applicable. One (1) on-site radiation survey at the time of installation with supporting documents.

 

 

Test Images:

 

 

UNICOMP Metal X Ray Machine For BGA Connectivity And Analysis AX9100 0

 

 

Contact Details
Unicomp Technology

Contact Person: Unicomp-sales

Tel: +8613502802495

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