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High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection

Certification
China Unicomp Technology certifications
China Unicomp Technology certifications
Customer Reviews
Stable product quality , reliable cooperation partner

—— Mr. Smith

Unicomp Techology is really impressive.

—— Selvam N

You are good and reliable supplier again thanks

—— Mr. Merlin Euphemia

The feedback we got from the unit we purchased is so far very good. The client is happy.

—— Mr. Nicholas

A professional service team Life-long free software upgrading Timely technical support

—— Ms Rein

We have visited Unicomp . It is big company in China . And their engineers are so professional .

—— Mr Okan

Scheduled call & visits Onsite installation, debugging and training services

—— Mrs Yulia

Nice work on the X-Ray machine!

—— Qusaay Albayati

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High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection

China High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection supplier
High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection supplier

Large Image :  High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection

Product Details:

Place of Origin: China
Brand Name: Unicomp
Certification: CE, FCC
Model Number: AX9100

Payment & Shipping Terms:

Minimum Order Quantity: 1
Packaging Details: Polywood case package data:166cm*156cm*195cm total weight:1900KG
Delivery Time: 45 days
Payment Terms: T/T
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Detailed Product Description
Function: PCBA,BGA Inspection Equipment: Quality Check
High Light:

electronics x ray system

,

x ray equipment

  • Application
  • Semiconductor, Packaging components, Battery Industry,
  • Electronic components, Automotive parts, Photo-voltaic,
  • Ceramics, other special industries.
  • Aluminium Die-casting, Moulding Plastic.
  • SMT, BGA, CSP, Flip Chip, LED Detection.

       High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection 0High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection 1

 


 

  • Features
  • Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification
  • X-ray tube & detector automatic lifting and descending, with convenient target point positioning system
  • Multi-function DXI image processing system, CNC programmable detection
  • 130kV (Option 110KV) 3µm closed X-ray tube, high speed & Millions pixels high resolution FPD
  • Tilt detection with 55° and rotation 360°operation together with 6 axis movement

   High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection 2


 

  •  X-ray Images

      High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection 3


 

  • Technical Specifications

 

 

Item Description Specifications
X-Ray Tube Max. Voltages, Type 130kV (Option 110KV), Closed
Power Consumption 40W(25W)
Focal Spot Size 3 μm
Magnification 1600X
Detector Detector Type FPD
Resolution 101 LP/cm
Effective Area 116.4mm ×145.7mm
System Computer Operating System Industrial PC, Win 7, i7 Processor
Monitor 22” LCD
Software User Interface Unicomp Multi-function DXI image processing system
Working Platform Max. Loading Area φ570mm
Max. Inspection Area 450mm×450mm
Max. Loading Weight 10kg
Movement Control Joysticks, Mouse and Keypads
Motion Range (Up and Down) 200mm
Table Tilting Angle 55° Tilting and 360° Rotation
Navigation Camera HD Camera, Laser point
Axis Manipulator 6-axis with X1/ X2 / Y / Z / T(55°) / R(360°)
Equipment Features Power Supply AC 110~220V (±10%) 50Hz, 2.0kW
Outline Dimensions 1450(W)×1500(D)×1850(H)mm
System Weight 1900 kg
Optional Accessories None
Warranty

One year warranty , free replacement the parts due to original manufacturer's defect, but expect of man-made damages and force majeure

 

Contact Details
Unicomp Technology

Contact Person: Unicomp-sales

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