Chip Counter BGA X Ray Inspection Machine Micro BGA on chop analysis X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve ... Read More
Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check Specifications of Xray machine: System Summary Footprint 1200(W)1200(D)1500(H)mm Machine Weight 1130 kg Power Supply AC ... Read More
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal ... Read More
China Unicomp 90KV X-ray with HD PFD Inspection System for Chipset Defects Detecting Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small ... Read More