industrial inspection systems
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High Penetration X-Ray Machine Unicomp AX7900 For Printed Circuit Board Inspection
PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection Description of IC Xray machine AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection
FPD 90KV X-Ray Inspection System For Chipset Defects Detecting
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
Advanced X-Ray Inspection Equipment for Electronics Industry 1000kg Maximum Load
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: Large Size Inspection Table,Laser Pinpoint For Precise Location Accurate Control, CNC Programming,Automatic Positioning FPD Tilting 25 Safely Electromag
Industry Electronics Industry X-Ray Inspection Equipment for Wire 1280x1220x1615mm
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Large-Scale Inspection Table with Laser Pinpointing for Precise Localization High-Precision
Electronics SMT Cabinet Unicomp X Ray Inspection System AX8500 Failure Analysis
Electronics SMT Cabinet Unicomp X-Ray Inspection System AX8500 Failure Analysis Features: 100KV 5m X-Ray tube. FPD Detector. Real-time image. 1000X system magnification. 6 axis linkage system. X-ray tube and FPD simultaneously tilt 35. Modular design with In-line expansibility. Economical and Practical. Applications: LED,SMT,BGA,CSP,Flip Chip Inspection. Semiconductor,Packaging components,Battery Industry. Electronic components, Auto parts, Photovolta
Close Tube 1.6kW X Ray Inspection Equipment CSP For Medical Electronic Connector
close tube x-ray inspection equipment in China high resolution image system for medical Electronic connector inspection Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection.
Unicomp LX2000 CSP BGA X Ray Machine EMS Inline AXI Inspect Ceremic Air Hole
Using Unicomp LX2000 inline AXI X-ray to inspect ceremic air hole and cracks with Auto Inspection and Analysing Technical Parameters and Specifications System Summary Footprint 2595(W)1392(D)1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)170(D)190(H)cm (X-Ray) 150(W)105(D)120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.
Unicomp AX8500 X Ray Inspection Machine For SMT EMS BGA LED CSP QFN Soldering
Unicomp AX8500 X-ray inspection machine for SMT / EMS BGA LED CSP QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector
Micro Focus X Ray Semiconductor Inspection Equipment Inline 2D
Factory directly supply microfocus inline 2D X-ray machine to check Electronic Semiconductor IGBT with automatic defect recognition Technical Parameters and SpecificationsSystem SummaryFootprint2595(W)1392(D)1992(H)mmMachine Weight1900 kg (X-Ray) / 700kg (Conveyor)Power SupplyAC 110~220V, 50/60HzPlywood Packing Size180(W)170(D)190(H)cm (X-Ray) 150(W)105(D)120(H)cm (Conveyor)Packing Weight2000kg (X-Ray) / 800kg (Conveyor)Power Consumption3.5 kWX-Ray TubeTube TypeSealedMa
