industrial inspection systems
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100kV 1uSv/h X Ray Detection Machine 1.0KW For LED Soldering
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sm closed X-Ray tube, HD digital flat panel X-Ray tube & Detector motion up and down, friendly user interface and fast target point
LED Soldering 1kW 90KV X Ray Detection Equipment 24''
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
1kW 1uSv/H 90KV X Ray Scanning Machine For LED Lighting
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
0.8kW 5um FDA Electronics X Ray Machine For SMT BGA Soldering
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. System
0.8kW BGA Void Measurement X Ray Machine For Mobile Phone PCBA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Technical Data System SummaryFootprint1080(W)1180(D)1730(H)mmMachine Weight1050 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size146(W)128(D)196(H)cmPacking Weight1160 kgPower Consumption1.0 kWX-Ray TubeTube TypeSealedMax. Power8WVoltage0~90kV (Adjustable)Focus Spot Size5mImaging SystemDetectorFlat Panel Detector (option 4 i.i. Detector)Pixel Size85mEffective Detection Area130*130mmFrame Rates20fpsPi
Microfocus AX9100 CNC Mapping Unicomp X Ray 130kV For Motherboard
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection.
CSP LED 110kV X Ray Scanner 5um For LED Strip PCBA Soldering
110kV 5um microfocus AX8500 X-ray for LED Strip PCBA soldering void quality control Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector (FPD) Pixel Size
CSP BGA X Ray Scanner Machine 100KV FPD Microfocus Closed Tube AX8500
High resolution FPD with microfocus closed tube AX8500 X-ray system from Unicomp for LED inner bubble and void testing Technical Parameters and Specifications System SummaryFootprint1370(W)1300(D)1700(H)mmMachine Weight1600 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size1750(W)1500(D)2000(H)mmPacking Weight1800 kgPower Consumption2.0 kWX-Ray TubeTube TypeSealedMax. Power25WVoltage0~110kV (Adjustable)Focus Spot Size5mImaging SystemDetectorFlat Panel Detector (FPD
CSP SMT Electronics X Ray Machine 110kV Unicomp AX8500 For SMT PCBA BGA QFN
Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector (FPD) Pixel
