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Quality SMT BGA Soldering Void Measurement X-Ray Machine Microfocus 130kV factory

SMT BGA Soldering Void Measurement X-Ray Machine Microfocus 130kV

130kV 7 m Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Features: 1000X magnification, high-definition real-time image. 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. One

Quality AX9100 130kV Microfocus Electronics X Ray Machine With FPD Oblique View 360 Rotation Table factory

AX9100 130kV Microfocus Electronics X Ray Machine With FPD Oblique View 360 Rotation Table

AX9100 130kV microfocus X-ray with FPD oblique view and 360rotation table for electronic components check Features of Unicomp AX9100: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications of Unicomp AX9100: SMT, BGA, CSP, Flip

Quality 5um Close Tube AX9100 Unicomp X Ray Machine FPD Oblique View For IC Semicon Inspection factory

5um Close Tube AX9100 Unicomp X Ray Machine FPD Oblique View For IC Semicon Inspection

Unicomp 5m close tube AX9100 X-ray machine with FPD oblique view for IC Semicon inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 1600 X Detection Region Max.Loading Size 570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Quality AX9100 130kV Electronics X Ray Machine For Semiconductor Wire Bonding Sweep Inspection factory

AX9100 130kV Electronics X Ray Machine For Semiconductor Wire Bonding Sweep Inspection

High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 1600 X Detection Region Max.Loading Size 570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Quality AX9100 Unicomp X Ray Machine 130kV Close Tube For PCBA BGA QFN Soldering Void Check factory

AX9100 Unicomp X Ray Machine 130kV Close Tube For PCBA BGA QFN Soldering Void Check

130kV maintenance free close tube X-ray machine Unicomp AX9100 For PCBA BGA QFN soldering Void check Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 1600 X Detection Region Max.Loading Size 570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Quality Unicomp AX9180 180kV Microfocus Electronics X Ray Machine With FPD Oblique factory

Unicomp AX9180 180kV Microfocus Electronics X Ray Machine With FPD Oblique

Unicomp AX9180 180kV Microfocus Electronics X-Ray Machine With FPD Oblique AX9180 180kV microfocus X-ray system with FPD oblique view and 360 rotation table for comprehensive electronic components inspection. Key Features 180KV 10m X-Ray tube for precise imaging High-speed, high-resolution FPD with millions of pixels 1000X magnification with high-definition real-time imaging One-button operation with 2.5D image display Off-line programming function with navigation mode

Quality High magnifications PCB X-ray machine Unicomp AX9100MAX for electronics IC components bonding wire inspection  factory

High magnifications PCB X-ray machine Unicomp AX9100MAX for electronics IC components bonding wire inspection

High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery

Quality Low Breakdown 225KV NDT X Ray Machine Automotive Aircraft Vessel Inspection factory

Low Breakdown 225KV NDT X Ray Machine Automotive Aircraft Vessel Inspection

Unicomp X ray NDT Machine Automotive Aircraft Vessel Inspection Systems UNC225 Features: High reliable and long life,low breakdown High definition and resolution FPD C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend) Multi-functional workstation,360rotation and shift User friendly software design for easy interfacing can facilitate,customized software High penetration,Voltage up to 225KV,Maximum penetration thickness up

Quality High Resolution PCB X Ray Machine factory

High Resolution PCB X Ray Machine

Electronics PCB parts X ray Machine with a high-resolution imaging chain X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight