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Quality Unicomp UNC225 X-Ray Machine Identifies Flaws in Power Resin with 0.4mm/1.0mm Focal Size at 225kV factory

Unicomp UNC225 X-Ray Machine Identifies Flaws in Power Resin with 0.4mm/1.0mm Focal Size at 225kV

Unicomp UNC225 X-Ray Identifies Flaws in Power resin Mainly used in metal castings, hardware products, plastic products, refractory materials, resin materials, composite materials, ceramic body and welding metal parts and other small products for non-destructive testing. Functional Characteristics 1. Wide range of applications to meet the inspection of multiple sizes and types of products. Low failure rate, best-selling equipment for 9 years 2. Safety: High level protection,

Quality Unicomp AX9600 160KV Open Tube 2.5D X-ray for High-Precision TVS Diode Internal factory

Unicomp AX9600 160KV Open Tube 2.5D X-ray for High-Precision TVS Diode Internal

Unicomp High-end Semiconductor X-Ray Inspection System AX9600 UNICOMP AX9600 features a self-developed 160kV high-power open micro-focus X-ray tube, delivering an ultra-small 0.8m focal spot. With exceptional magnification up to 2000 times and outstanding ray penetration capacity, it accurately measures void ratio of TVS diodes, and is ideal for high-precision quality inspection of advanced IC packaging, HBM memory chips and GPU semiconductor components. Specifications:

Quality Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components factory

Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components

Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 m 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task

Quality Unicomp 110KV X-ray Inspection for MOSFET Void Detection and Reliability Analysis AX8300MAX factory

Unicomp 110KV X-ray Inspection for MOSFET Void Detection and Reliability Analysis AX8300MAX

Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 m 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task

Quality 110KV High-Resolution X-ray Unicomp AX8300 for Non-Destructive BGA Solder Joint Analysis factory

110KV High-Resolution X-ray Unicomp AX8300 for Non-Destructive BGA Solder Joint Analysis

High Resolution Semiconductor X-Ray Inspection Machine AX8300 AX8300 adopts self-developed 110kV high-power micro-focus X-ray source with ultra-fine 2m resolution. It supports 60 tilting & 360 rotating 2.5D omni-directional non-blind inspection, clearly identifying tiny internal defects of chips and solder joints. Our Service Commitment Response to inquiries within 12 hours Direct manufacturer pricing with competitive rates Comprehensive one-year warranty with free

Quality Unicomp UNCT2600 Industrial 225KV 3D Computed Tomography System NDT Quality Inspection factory

Unicomp UNCT2600 Industrial 225KV 3D Computed Tomography System NDT Quality Inspection

Unicomp UNCT2600 Industrial 225KV 3D Computed Tomography System NDT Quality Inspection Product Description: UNCT2600 is a highly sophisticated, compact industrial CT inspection system that can be used in a variety of sizes with materials, to meet the high precision inspection needs of different industries. Mainly used in small metal castings and colored metal, lithium new energy battery cells, chips, electronic devices, rock samples, core, soil, chemical stone, composite

Quality SMT EMS Detection Unicomp X Ray Machine PCBA BGA Inspection Linear Array Detector factory

SMT EMS Detection Unicomp X Ray Machine PCBA BGA Inspection Linear Array Detector

High Resolution Digital SMT EMS Detection X Ray Machine PCBA / BGA Inspection Linear Array Detector Specifications Operation System Windows Operation System 22" LCD Monitor Keyboard and Mouse X-Ray Machine Dimensions:1080(W)X1180(D)X1730(H) Packing Size:1420*1420*2000mm Weight: 1150KG Magnification:600X Power Requirements:220VAC 50Hz Temperature/Humidity:0 40 / 30 70RH Power Consuption(Max):0.5KW X-Ray Tube Voltage : 100KV Max Current: 200 A Focal Spot Size: 5 micron

Quality Automotive Front End Module NDT CT UNCT2600 factory

Automotive Front End Module NDT CT UNCT2600

Automotive Front End Module NDT CT UNCT2600 Product Description: UNCT2600 is a highly sophisticated, compact industrial CT inspection system that can be used in a variety of sizes with materials, to meet the high precision inspection needs of different industries. Mainly used in small metal castings and colored metal, lithium new energy battery cells, chips, electronic devices, rock samples, core, soil, chemical stone, composite materials, biological samples, etc. Features:

Quality Bar and Plate Heat Exchangers NDT CT UNCT2600 factory

Bar and Plate Heat Exchangers NDT CT UNCT2600

Bar and Plate Heat Exchangers NDT CT UNCT2600 Features: Functions: DR And CT dual imaging detection function; 3D scanning, data reconstruction and analysis. Safety: High level protection, radiation dose far lower than the national standard; multiple security measures. Operation: User-friendly design of the control system, easy to operate, after a short training can be mastered. Precision: High-precision mechanical transmission system, advanced image processing and analysis