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Unicomp AX7900 X Ray Inspection Machine For Electric Switch Inner Quality Testing
Unicomp AX7900 X Ray Inspection Machine for Electric Switch Inner Quality Testing FEATURES of IC Xray machine AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. 60 "Arc" motion(Option). Motion controls include X/Y table motion plus Z-axis tube and detector movement, 60 tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm
AX7900 Real Time Digital X Ray Machine For Switch Inner Defects Inspection
Real Time Digital X-Ray Machine AX7900 for Switch Inner Defects Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz
5um High Resolution X Ray Equipment For Electric Switch Unicomp Factory Manufacturing
Unicomp Factory Manufacturing 5m High Resolution X-ray Equipment for Electric Switch Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 80kV/90kV Max.Power 12W/8W Spot Size 5m/15m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 160 X/360X Detection Region Max.Loading Size 440mm x 400mm Max.Inspection Area 420mm
AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection
AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
AX7900 Real Time Auto Offline X Ray Machine For Electronics Inner Defect Inspection
AX7900 Real Time Auto-Offline X Ray Machine For Electronics Inner Defect Inspection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power
FPD 90KV X Ray Inspection System For PCBA Defect Detection Unicomp AX7900
FPD 90KV X Ray Inspection System for PCBA defect Detection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption
Unicomp Quality Control X Ray Inspection Machine For SMT Industry
Unicomp factory supply quality control X-ray inspection machine for SMT industry APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
Real Time Digital X Ray Machine AX7900 For PCBA Inner Defects Inspection
Unicomp factory supply quality control X-ray inspection machine for SMT industry APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
Unicomp X-ray system AX7900 for internal defect inspection of Electronic Components
Unicomp X-Ray inspection machine AX7900 for BGA inspection of Electronic Components FEATURES of IC Xray machine AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. 60 "Arc" motion(Option). Motion controls include X/Y table motion plus Z-axis tube and detector movement, 60 tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x
