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HD BGA X Ray Inspection Machine For Electronic And Electrical Components
BGA X-Ray Inspection Machine for Electronic and electrical components Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200A Spot Size 5m Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360 rotary fixture (Optional) X-ray Leakage
PCBA Soldering BGA X Ray Inspection Machine High Speed With Large Sample Table
Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55 and rotation 360operation together with 6 axis movement 130kV (Option 110KV) 7m closed X-ray tube, high speed & Millions
Semiconductor SMT Bga X Ray Inspection System For Internal Defects Detection
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 7m closed X-ray tube, high speed &
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector
Finefocus Tube 100KV X Ray Scanner AX8200 For PCBA Inspection
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. Technical Data
0.8kW BGA Void Measurement X Ray Machine For Mobile Phone PCBA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Technical Data System SummaryFootprint1080(W)1180(D)1730(H)mmMachine Weight1050 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size146(W)128(D)196(H)cmPacking Weight1160 kgPower Consumption1.0 kWX-Ray TubeTube TypeSealedMax. Power8WVoltage0~90kV (Adjustable)Focus Spot Size5mImaging SystemDetectorFlat Panel Detector (option 4 i.i. Detector)Pixel Size85mEffective Detection Area130*130mmFrame Rates20fpsPi
CSP LED 110kV X Ray Scanner 5um For LED Strip PCBA Soldering
110kV 5um microfocus AX8500 X-ray for LED Strip PCBA soldering void quality control Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector (FPD) Pixel Size
CSP BGA X Ray Scanner Machine 100KV FPD Microfocus Closed Tube AX8500
High resolution FPD with microfocus closed tube AX8500 X-ray system from Unicomp for LED inner bubble and void testing Technical Parameters and Specifications System SummaryFootprint1370(W)1300(D)1700(H)mmMachine Weight1600 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size1750(W)1500(D)2000(H)mmPacking Weight1800 kgPower Consumption2.0 kWX-Ray TubeTube TypeSealedMax. Power25WVoltage0~110kV (Adjustable)Focus Spot Size5mImaging SystemDetectorFlat Panel Detector (FPD
Semiconductor 110kV Electronics X Ray Machine 5um AX8500 For PCBA BGA
110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector (FPD)
