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Semiconductor SMT Bga X Ray Inspection System For Internal Defects Detection
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 7m closed X-ray tube, high speed &
SMT BGA X Ray Detection Equipment Flip Chip FPD Detector 130KV For Semicon
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7m closed X-ray tube, high speed & Millions pixels high resolution FPD X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image
High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
CNC Programmable Detection Electronics X Ray Machine Golf Ball Inner Quality Inspection
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7m closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
Multi - Function Electronics X Ray Machine High Speed Real Time For Gold Ball
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
PCB BGA Inspection Electronics X Ray Machine Golf Ball Inside Quality Checking
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55 and rotation 360operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
No Chip Damage X Ray Chip Counter 440mm Tunnel Size Automatic Counting With Inline Mode
Electronic Components Counting System Production Line X-ray Counter LX6000 Manual component counting requires hours and includes the possibility of miscounts resulting in machine down-time, inaccurate inventory management, and ultimately reduced profit margins. Seamless and flexible automation means more up-time on the assembly line and increased productivity. Component counting using Unicomp X-Ray technology can take only seconds for an entire reel. Increase productivity
99.8% Inspection Accuracy X Ray Counter Fast Speed With 01005 Counting Capability
Electronic Components Counting System Production Line X-ray Counter LX6000 Manual component counting requires hours and includes the possibility of miscounts resulting in machine down-time, inaccurate inventory management, and ultimately reduced profit margins. Seamless and flexible automation means more up-time on the assembly line and increased productivity. Component counting using Unicomp X-Ray technology can take only seconds for an entire reel. Increase productivity
0.1m/s Auto SMD X Ray Chip Counter 440mm Tunnel Size For Large Reel Inspection
Electronic Components Counting System Production Line X-ray Counter LX6000 Manual component counting requires hours and includes the possibility of miscounts resulting in machine down-time, inaccurate inventory management, and ultimately reduced profit margins. Seamless and flexible automation means more up-time on the assembly line and increased productivity. Component counting using Unicomp X-Ray technology can take only seconds for an entire reel. Increase productivity
