Arrived! Nanoscale Industrial 3D/CT Equipment: Shaping the Future with Precision

According to data released by WSTS, global semiconductor sales reached USD 630.5 billion in 2024, representing a 19.7% year-on-year increase.

Driven by artificial intelligence, the market is projected to surpass USD 1 trillion by 2030.

As the internal three-dimensional architectures of chips — including Chiplet stacking and hybrid bonding — grow increasingly complex, fundamental breakthroughs in 3D integration technology are driving transformative changes in semiconductor manufacturing.

Conventional inspection methods fail to accurately locate micron-level defects such as TSV voids and solder ball cracks.

Nanoscale 3D non-destructive testing technology has become critical for advanced manufacturing to improve yield and avoid losses at the ten-million level.

Unicomp Technology

Nanoscale Open-Tube 3D/CT Inspection Equipment

Empowered by "AI + X-ray"

It enables clearer, more precise and more efficient inspection.

Defects are clearly identified at the nanoscale.

Unicomp Technology AX9500 – Multi-Mode Industrial CT System Innovatively integrating open-type X-ray source non-destructive penetration technology and AI intelligent inspection system, it features multi-mode high-efficiency imaging capabilities.

Designed specifically for precision semiconductor inspection, this equipment utilizes 3D non-destructive scanning and high-precision tomographic imaging to accurately capture and identify critical defects in wafer-level and advanced packaging processes.

These include wafer bump bridging, chip cold joints, and voids in MEMS manufacturing, effectively addressing the industry’s high-difficulty defect detection bottlenecks.

Nanoscale Open Tube

160kV High Penetration

In 3D packaging, X-rays must penetrate dozens of stacked layers with a total thickness of up to several millimeters. Low-energy X-rays cannot penetrate high-density regions such as copper interconnect layers.

The 160kV source easily penetrates multi-layer heterogeneous materials such as silicon and copper, enabling deep inspection of internal structures and precise detection of internal defects.

2000X Super Magnification

With advancements in semiconductor technology, critical defect dimensions have trended toward the sub‑micron scale.

Clear imaging of such defects requires the CT system to achieve nanometer‑level spatial resolution.

Unicomp Technology’s self-developed open-type X-ray source delivers a resolution of 0.8 µm.

Its nanofocus enables precise detection of defects including TSV voids and micro-cracks from chip cold welding.

Multi-Mode Imaging

4 IN ONE

Precision, efficiency, penetration depth and defect coverage form a tetrahedral technical challenge in semiconductor non-destructive testing.

Any single imaging mode can meet at most two of these requirements.