Productronica 2026 Munich: Meet Unicomp & Witness the Power of AI Intelligent Inspection

Productronica Shanghai 2026 was held at the Shanghai New International Expo Centre from March 25 to 27.

With a scale of 100,000 square meters, the exhibition gathers more than 1,000 exhibitors, focusing on smart factories,

new energy vehicle technologies and a digital future, showcasing full-chain innovations in the electronics industry.

Technology Reveals the Invisible.

Modern chip manufacturing has entered the nanometer scale.

A tiny defect—such as a speck of dust or a dimensional deviation—can lead to the failure of an entire transistor, thereby ruining costly chips.

Unicomp Technology (Booth No.: E5.5350, Hall E5) has addressed cutting-edge industry demands and unveiled its industrial AI-driven non-destructive intelligent inspection solutions at the exhibition,

targeting high-end manufacturing sectors including semiconductors, consumer electronics and automotive electronics.

The solutions enable detection of critical defects with higher precision, such as solder fillet height, voids, bridging, cold joints and cracks.

Unicomp Technology's self-developed microfocus X-ray source series covers the full voltage range from 90kV to 180kV,

and has achieved large‑scale industrial application worldwide.

In the future, Unicomp Technology will continue to deepen its presence at the cutting edge of the industry, identify market insights,

empower customers with innovative inspection technologies, and jointly move toward an intelligent manufacturing future of 'zero defects'.