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Home / Products / Electronics X Ray Machine / BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance
Quality BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance factory
Quality BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance factory
Quality BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance factory
Quality BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance factory
Quality BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance factory

BGA Void Solder Joint Inspection UNICOMP AX8300 X-ray System for PCBA Manufacturing Quality Assurance

Basic Properties
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX8300
Trading Properties
Minimum Order Quantity: 1Set
Price: can negotiate
Payment Terms: T/T,L/C
Supply Ability: 30 sets per month
Tags

x ray equipment

electronics x ray system

electronic inspection equipment
Product Summary
SMT electronics x ray machine sealed type X-ray Tube x-ray 110kv AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ...

Product Details

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electronics x ray system

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x ray equipment

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SMT Electronics X Ray System
Name: Electronics X Ray Machine
Measuring Volume: Max Load Area 300x300mm
Tube Voltage: 110KV
Industry: Electronics Industry
Size: 1100(L)x1100(W)x1650(H)mm
Radiation Safety: <1μSv/hr(<0.1mR/hr)at The Cabinet Surface 5cm
Product Description

SMT electronics x ray machine sealed type X-ray Tube x-ray 110kv



AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on.



Major applications:


PCBA BGA/IC LED Aliminum die casting Battery connector inspecting


1. Semiconductor package


2. Electronic connector module.


3. Original Package


4. Aerospace components


5. Medical appliances


6. Automation components



Application:


1. BGA/CSP/FLIPS CHIP:   
Bridging ,Voids,Opens,Expcessive/insufficient
 

2. QFN:Bridging,Voids,Opens,Registration
 

3. SMT Standard components:
QFP,SOT,SOIC,Chips,Connectors,Others
 

4. Semiconductor:
bond wire,die attach VOID ,MOLD,VOID
 

5. Multi-layer board(MLB):
Inner layer registration,PAD stack,blind/buried vias




Overall Rating
5.0
★★★★★
★★★★★
Based on 50 reviews recently
5 star
100%
4 star
0
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0
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All Reviews
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE

Mr. James Lee

Marketing Director

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