Electronic Components BGA X Ray Inspection Machine

Online inspection system for Checking LED Semiconductor Electronic Components

The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system.

X-ray Inspecting Features:

(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder

shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint

devices can also be checked by X-Ray.

(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such

as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.

(3) The test preparation time is greatly reduced.

(4) It can observe other means of detection can not be reliably detected defects, such as: Empty

soldering, air holes and poor molding and so on.

(5) Double layers board and multi-layer boards only one check (with layered function).

(6) Can provide relevant measurement information, used to evaluate the production process. Such as

solder paste thickness, solder joints under the amount of solder.

Training

Training will include:

Basic Radiation Safety.
X-Ray system control functions.
X-Ray image processing software training.
Basic X-ray signature analysis training.
Hands-on sample analysis using your typical samples.
Training certificates for all attendees.