Payment & Shipping Terms:
|Name:||X-ray Inspection Machine||Max.Loading Size:||Φ570mm|
|Max.Inspection Area:||450mm X 450mm||Industry:||Electronics Industry|
bga x ray inspection system,
bga inspection equipment
SMT , BGA , CSP , Flip Chip , LED BGA X Ray Inspection Machine
Unicomp X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system.
|System Magnification||1600 X|
|Detection Region||Max.Loading Size||Φ570mm|
|Max.Inspection Area||450mm x 450mm|
X-ray Inspecting Features:
(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.
(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.
(3) The test preparation time is greatly reduced.
(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.
(5) Double layers board and multi-layer boards only one check (with layered function).
(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.
Contact Person: Unicomp-sales