Product Details:
Payment & Shipping Terms:
|
Name: | X-ray Inspection Machine | Industry: | Electronics Industry |
---|---|---|---|
Size: | 1100(L)x1100(W)x1650(H)mm | X-ray Leakage: | < 1uSv/h |
Weight: | 1500kg | Power Consumption: | 1.5KW |
Highlight: | metal detector x ray machine,x ray metal inspection |
SMD Cable Electronics Components Unicomp X-ray Detector AX8300
Model |
AX8300 |
Max kV/type |
110 kV(Option90 kV)/Sealed |
Max.Electron beam power |
25W(Option8W) |
Focal spot size1 |
7μm |
System magnification |
Up to 1000X |
Imaging system(Option) |
Flat Panel Detector |
Manipulator |
8-axis with tilt 50 degree |
Measuring volume |
Max load area 300x300mm2 |
Max.sample weight |
5kg |
Monitors |
22" LCD |
Cabinet dimensions |
1100x1100x1650mm |
Weight |
1700kg |
Radiation safety2 |
<1μSv/hr(<0.1mR/hr)at the cabinet surface 5cm |
Control |
Keyboard/Mouse/Joystick |
Automated inspection |
Standard |
Primary applications |
Chip inspection/Electronic components/Auto parts.etc |
1.Focal spot size is a variable.Please consult the unicomp 2.X-ray Safety Commitment:All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems.The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed.5millirem/hr.2"from any external surface.Our machines are typically 15times less emission. |
Applications
Solder reflow analysis
BGA connectivity and analysis
Solder void calculation
Through hole measurement and inspection
Die attach voiding measurement
Ball bond analysis
Stitch bond analysis
Micro BGA / chip on chop analysis
Pad array analysis
Dry joint detection and analysis
Object Stage Control
1. by the spacebar to adjust stage speed: slow, constant and fast speed
2. Keyboard control X, Y, Z three-axis motion and inclined angle
3. The user can control the stage speed and angle programmatically
Inspection Images:
Contact Person: Mr. James Lee
Tel: +86-13502802495
Fax: +86-755-2665-0296