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Laboratory Benchtop X Ray Machine for LED / Flip Chip / Semiconductor

Basic Properties
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: CX3000
Trading Properties
Minimum Order Quantity: 1Set
Price: can negotiate
Payment Terms: T/T,L/C
Supply Ability: 30 sets per month
Product Summary
Laboratory Benchtop X Ray Machine for PCB , LED , Flip Chip , Semiconductor Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray ...

Product Details

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x ray detection systems

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x ray detector

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Laboratory Benchtop X Ray Machine

Name: Benchtop X Ray Machine
Application: LED , Flip Chip , Semiconductor
Tube Voltage: 100KV
Industry: Electronics Industry
X-Ray Coverage: 48mm X 54mm
Resolution: 208Lp/cm
Product Description

Laboratory Benchtop X Ray Machine for PCB , LED , Flip Chip , Semiconductor

 

 

Item Definition Specs
System Parameters Size 750(L)x570(W)x890(H)mm
Weight 300kg
Power 220AC/50Hz
Power Consumption 0.5kW
X-ray Tube Type Closed
Max.Voltage 100kV
Max.Power 200μA
Spot Size 5μm
Detector Intensifier FPD
X-ray Coverage 48mm x 54mm
Resolution 208Lp/cm
Work Station Max.Loading Size 200mm x 200mm
Max.Inspection Area 200mm x 200mm
Oblique Angle Views 360° rotary fixture (Optional)
X-ray Leakage <1μSv/h


 

 

OUR SERVICE

 

1.Your inquiry will be replied in 12 hours.

 

2.Original Manufacture to customers, with competitive price.

 

3.We provide one year warranty, free training and whole life technology support.

 

4.We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment.

 

5.Well-trained and Professional after-sales service team to support you.

 

6.Manual will package with machine . It will show you how to use machine step by step.

 

7.Items are only shipped after payment is received.

 

 

Full Automatic BGA Testing Procedures

 

1. A simple mouse click programming without the need for operator intervention on the component can detects each BGA automatically.

 

2. Automatic BGA test, accurately check the bridge, Welding, cold welding and void ratio of BGA.

 

3. Automatic BGA test repeatable test results in order to process control

 

4. The test results will be displayed on the screen and can be output to Excel to facilitate review and archiving

 

 

NC Programming

 

1.A simple mouse clicks operation write test procedures

 

2.The stage can be X, Y director positioning; X-ray tube and detector Z positioning.

 

3.Software setting voltage and current

 

4.Image settings: brightness, contrast, auto gain and exposure

 

5.The user can set the program switch pause time

 

6.Anti-collision system can meet the maximum tilt and observe objects

 

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