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Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding

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China Unicomp Technology certification
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Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding

Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding
Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding

Large Image :  Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding

Product Details:
Place of Origin: China
Brand Name: Unicomp
Certification: CE, FDA
Model Number: AX8200MAX
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: can negotiate
Packaging Details: Wooden Case, Waterproof, Anti-collision
Delivery Time: 30 work days
Payment Terms: T/T, L/C
Supply Ability: 300 pcs per month
Detailed Product Description
Tube Voltage: 0~90kV (Adjustable) Tube Type: Sealed
Focus Spot Size: 5μm Detector: Flat Panel Detector (FPD)
Packing Weight: 1520 Kg Power Supply: AC 110/220V, 50/60Hz
Power Consumption: 2.0 KW X-Ray Safety: <1μSv/h (Meets All International Standards)

Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc.

 

 

Application Fields of X Ray Machine AX8200Max

 

Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding 0 Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding 1 Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding 2 Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding 3 Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding 4
SMT/PCBA
Inspection
Semiconductor
Inspection
Lithium Batteries
Inspection
LED Inspection Photovoltaic
Inspection

 

 

Functions and Features

 

Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding 5

 

 

Technical Parameters and Specifications of X Ray Machine AX8200Max

 

System Summary
 Footprint  1280(W)×1500(D)×1700(H)mm
 Machine Weight  1370 kg
 Power Supply  AC 110/220V, 50/60Hz
 Plywood Packing Size  1750(W)×1920(D)×2000(H)mm
 Packing Weight  1520 kg
 Power Consumption  2.0 kW
X-Ray Tube
 Tube Type  Sealed
 Max. Power  8W
 Voltage  0~90kV (Adjustable)
 Focus Spot Size  5μm
Imaging System
 Detector  Flat Panel Detector (FPD)
 Pixel Size  85μm
 Effective Detection Area  130*130mm
 Frame Rates  20fps
 Pixel Matrix  1536*1536
 System Magnification  600X
Software
 Auto-measuring  BGA Soldering Voids Auto-measuring and Support Data/Graphic Output
 Multiple Measuring Tools  Support Measuring Distance, Angle, Diameter, Polygon, PTH filling rate, etc.
 CNC Mode  CNC Programmable Inspection, Easy Operation and User Friendly
 Real-time Display  Real-time Displaying the Working Data of Voltage, Current, Angle, Date, etc
 Navigation  Convenient Target Point Positioning System
Motion Control System
 Movement Control  Joystick, Keypad, Mouse &Touch Panel
 Max. Loading Area/Weight  610*610mm / 10kg
 Max. Inspection Area  550*550mm
 Oblique Views  Max. 60°
 Manipulator  6-axis with X / Y / Z1 / Z2 / T1 / T2
Industrial PC
 Monitor  24’’ FHD Interactive Touch LCD Display
 System OS  Windows 10 64bit
 Hard disk  1TB
 RAM  8GB
 CPU model  Intel i7 Processor
Other Features
 Door Open  Electric Sliding
 X-Ray Safety  <1μSv/h (Meets All International Standards)
 Authority Management  Fingerprint Access Magnagement System, and Support Password  Accessing.
 Safety Operation  Electromagnetic Interlock, Warning Light and Real-time Radioation Leakage Monitor

 

* Specifications are subject to change without notice, All trademarks are the property of the system maker.

 

 

X-Ray Images

 

Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding 6

 

 

Dimensions and Appearance

 

Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding 7

Contact Details
Unicomp Technology

Contact Person: Unicomp-sales

Tel: +8613502802495

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