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PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection

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China Unicomp Technology certification
China Unicomp Technology certification
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Stable product quality , reliable cooperation partner

—— Mr. Smith

Unicomp Techology is really impressive.

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You are good and reliable supplier again thanks

—— Mr. Merlin Euphemia

The feedback we got from the unit we purchased is so far very good. The client is happy.

—— Mr. Nicholas

A professional service team Life-long free software upgrading Timely technical support

—— Ms Rein

We have visited Unicomp . It is big company in China . And their engineers are so professional .

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PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection

PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection
PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection

Large Image :  PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection

Product Details:
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX7900
Payment & Shipping Terms:
Minimum Order Quantity: 1Set
Price: can negotiate
Packaging Details: Wooden Case, Waterproof, Anti-collision
Delivery Time: 30 days
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
Detailed Product Description
Name: Unicomp X-ray Inspection Machine Application: SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage: 80KV/90KV Industry: Electronics Industry
Size: 1100(L)x1100(W)x1500(H)mm X-ray Leakage: < 1uSv/h
Weight: 1000kg Power Consumption: 0.8KW
High Light:

Bond Wire Unicomp X Ray machine

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High Resolution Unicomp X Ray machine

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PCBA X ray Inspection Machine

PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection
 


Description of IC Xray machine AX7900:
 

90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection area 380 x 380mm, with ~300X System Magnification.
 
 
FEATURES of IC Xray machine AX7900:
 

  1. 90KV 5μm X-ray tube, FPD Detector.
  2. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
  3. Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option).
  4. Multi-function DXI image processing system.
  5. X/Y programming function for multiple image inspection routines
  6. Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
  7. BGA void/area auto-measurement plus report generation.

APPLICATION of IC Xray machine AX7900:

  1. LED, SMT, BGA, CSP, Flip Chip Inspection.
  2. Semiconductor, Packaging components, Battery Industry.
  3. Electronic components, Auto parts, Photovoltaic Industry.
  4. Aluminum Die Casting, Moulding Plastic.
  5. Ceramics, Other Special Industries

 

Technical Specifications

Item Definition Specs
System Parameters Size 1100(L)x1100(W)x1500(H)mm
Weight 1000kg
Power 220AC/50Hz
Power Consumption 0.8kW
X-ray Tube Type Closed
Max.Voltage 80kV/90kV
Max.Power 12W/8W
Spot Size 5μm/15μm
X-ray System Intensifier FPD
Monitor 22 ‘’LCD
System Magnification 160 X/360X
Detection Region Max.Loading Size 440mm x 400mm
Max.Inspection Area 420mm x 380mm
X-ray Leakage <1μSv/h

 
 
Inspection Images of IC Xray machine AX7900:

 

PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection 0

Contact Details
Unicomp Technology

Contact Person: Mr. James Lee

Tel: +86-13502802495

Fax: +86-755-2665-0296

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