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AX7900 Unicomp X Ray Machine 5 Micron Focus Spot Closed Tube For SMT BGA QFN IC Inspection

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AX7900 Unicomp X Ray Machine 5 Micron Focus Spot Closed Tube For SMT BGA QFN IC Inspection

AX7900 Unicomp X Ray Machine 5 Micron Focus Spot Closed Tube For SMT BGA QFN IC Inspection
AX7900 Unicomp X Ray Machine 5 Micron Focus Spot Closed Tube For SMT BGA QFN IC Inspection

Large Image :  AX7900 Unicomp X Ray Machine 5 Micron Focus Spot Closed Tube For SMT BGA QFN IC Inspection

Product Details:
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX7900
Payment & Shipping Terms:
Minimum Order Quantity: 1Set
Price: can negotiate
Packaging Details: Wooden Case, Waterproof, Anti-collision
Delivery Time: 30 days
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
Detailed Product Description
Name: Unicomp X-ray Inspection Machine Application: SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage: 80KV/90KV Industry: Electronics Industry
Size: 1100(L)x1100(W)x1500(H)mm X-ray Leakage: < 1uSv/h
Weight: 1000kg Power Consumption: 0.8KW
High Light:

BGA QFN Unicomp X Ray machine

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IC Inspection Unicomp X Ray machine

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DXI image X ray Inspection Machine

5 micron focus spot closed type tube X-Ray machine Unicomp AX7900 for SMT BGA QFN IC inspection
 
 
 
Description of IC Xray machine AX7900:
 

90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection area 380 x 380mm, with ~300X System Magnification.
 
 
FEATURES of IC Xray machine AX7900:
 

  • 90KV 5μm X-ray tube, FPD Detector.
  • Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
  • Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option).
  • Multi-function DXI image processing system.
  • X/Y programming function for multiple image inspection routines
  • Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
  • BGA void/area auto-measurement plus report generation.

 


APPLICATION of IC Xray machine AX7900:

 

  • LED, SMT, BGA, CSP, Flip Chip Inspection.
  • Semiconductor, Packaging components, Battery Industry.
  • Electronic components, Auto parts, Photovoltaic Industry.
  • Aluminum Die Casting, Moulding Plastic.
  • Ceramics, Other Special Industries

 

Technical Specifications

Item Definition Specs
System Parameters Size 1100(L)x1100(W)x1500(H)mm
Weight 1000kg
Power 220AC/50Hz
Power Consumption 0.8kW
X-ray Tube Type Closed
Max.Voltage 80kV/90kV
Max.Power 12W/8W
Spot Size 5μm/15μm
X-ray System Intensifier FPD
Monitor 22 ‘’LCD
System Magnification 160 X/360X
Detection Region Max.Loading Size 440mm x 400mm
Max.Inspection Area 420mm x 380mm
X-ray Leakage <1μSv/h

 
 
Inspection Images of IC Xray machine AX7900:
AX7900 Unicomp X Ray Machine 5 Micron Focus Spot Closed Tube For SMT BGA QFN IC Inspection 0

Contact Details
Unicomp Technology

Contact Person: Tony Tang

Tel: +8618774513130

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