AX7900 Unicomp X Ray Machine 5 Micron Focus Spot Closed Tube For SMT BGA QFN IC Inspection
Basic Properties
Place of Origin:
China
Brand Name:
UNICOMP
Certification:
CE, FDA
Model Number:
AX7900
Trading Properties
Minimum Order Quantity:
1Set
Price:
can negotiate
Payment Terms:
T/T,L/C
Supply Ability:
300 sets per month
Product Summary
5 micron focus spot closed type tube X-Ray machine Unicomp AX7900 for SMT BGA QFN IC inspection Description of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD ...
Product Details
Highlight:
AX7900 Unicomp X Ray machine
,5 micron focus spot X Ray
,SMT BGA inspection X Ray
Name:
Unicomp X-ray Inspection Machine
Application:
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage:
90KV
Industry:
Electronics Industry
Size:
1215(L)x1325(W)x1700(H)mm
X-Ray Leakage:
< 1uSv/h
Weight:
1240kg
Power Consumption:
0.8KW
Product Description
5 micron focus spot closed type tube X-Ray machine Unicomp AX7900 for SMT BGA QFN IC inspection
Description of IC Xray machine AX7900:
90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 600mm x 520mm , max. detection area 505 x 440mm, with ~52X Geometric Magnification.
FEATURES of IC Xray machine AX7900:
- 90KV 5μm X-ray tube, FPD Detector.
- Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
- Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option).
- Multi-function DXI image processing system.
- X/Y programming function for multiple image inspection routines
- Max. loading area 600mm x 520mm , max. detection area 505 x 440mm, with ~52X Geometric Magnification.
- BGA void/area auto-measurement plus report generation.
APPLICATION of IC Xray machine AX7900:
- LED, SMT, BGA, CSP, Flip Chip Inspection.
- Semiconductor, Packaging components, Battery Industry.
- Electronic components, Auto parts, Photovoltaic Industry.
- Aluminum Die Casting, Moulding Plastic.
- Ceramics, Other Special Industries
Technical Specifications
| Item | Definition | Specs |
| System Parameters | Size | 1215(L)x1325(W)x1700(H)mm |
| Weight | 1240kg | |
| Power | 220AC/50Hz | |
| Power Consumption | 0.8kW | |
| X-ray Tube | Type | Closed |
| Max.Voltage | 90kV | |
| Max.Power | 8W | |
| Spot Size | 5μm | |
| X-ray System | Intensifier | FPD |
| Monitor | 24 ‘’LCD | |
| System Magnification | 52X | |
| Detection Region | Max.Loading Size | 600mm x 520mm |
| Max.Inspection Area | 505mm x 440mm | |
| X-ray Leakage | <1μSv/h | |
Inspection Images of IC Xray machine AX7900:
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