Product Details:
Payment & Shipping Terms:
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Name: | Unicomp X-ray Inspection Machine | Application: | SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor |
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Tube Voltage: | 80KV/90KV | Industry: | Electronics Industry |
Size: | 1100(L)x1100(W)x1500(H)mm | X-ray Leakage: | < 1uSv/h |
Weight: | 1000kg | Power Consumption: | 0.8KW |
Highlight: | High penetration Unicomp X-Ray machine,AX 7900 Unicomp X-Ray machine,Electronics Industry X-Ray Unicomp machine |
PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection
Description of IC Xray machine AX7900:
90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection area 380 x 380mm, with ~300X System Magnification.
APPLICATION of IC Xray machine AX7900:
FEATURES of IC Xray machine AX7900:
Technical Specifications
Item | Definition | Specs |
System Parameters | Size | 1100(L)x1100(W)x1500(H)mm |
Weight | 1000kg | |
Power | 220AC/50Hz | |
Power Consumption | 0.8kW | |
X-ray Tube | Type | Closed |
Max.Voltage | 80kV/90kV | |
Max.Power | 12W/8W | |
Spot Size | 5μm/15μm | |
X-ray System | Intensifier | FPD |
Monitor | 22 ‘’LCD | |
System Magnification | 160 X/360X | |
Detection Region | Max.Loading Size | 440mm x 400mm |
Max.Inspection Area | 420mm x 380mm | |
X-ray Leakage | <1μSv/h |
Inspection Images of IC Xray machine AX7900:
Contact Person: Mr. James Lee
Tel: +86-13502802495
Fax: +86-755-2665-0296