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High Magnifications PCB X-ray Machine Unicomp AX9100MAX For Electronics IC Components Bonding Wire Inspection

Certification
China Unicomp Technology certification
China Unicomp Technology certification
Customer Reviews
Stable product quality , reliable cooperation partner

—— Mr. Smith

Unicomp Techology is really impressive.

—— Selvam N

You are good and reliable supplier again thanks

—— Mr. Merlin Euphemia

The feedback we got from the unit we purchased is so far very good. The client is happy.

—— Mr. Nicholas

A professional service team Life-long free software upgrading Timely technical support

—— Ms Rein

We have visited Unicomp . It is big company in China . And their engineers are so professional .

—— Mr Okan

Scheduled call & visits Onsite installation, debugging and training services

—— Mrs Yulia

Nice work on the X-Ray machine!

—— Qusaay Albayati

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High Magnifications PCB X-ray Machine Unicomp AX9100MAX For Electronics IC Components Bonding Wire Inspection

High Magnifications PCB X-ray Machine Unicomp AX9100MAX For Electronics IC Components Bonding Wire Inspection
High Magnifications PCB X-ray Machine Unicomp AX9100MAX For Electronics IC Components Bonding Wire Inspection High Magnifications PCB X-ray Machine Unicomp AX9100MAX For Electronics IC Components Bonding Wire Inspection High Magnifications PCB X-ray Machine Unicomp AX9100MAX For Electronics IC Components Bonding Wire Inspection

Large Image :  High Magnifications PCB X-ray Machine Unicomp AX9100MAX For Electronics IC Components Bonding Wire Inspection

Product Details:
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX9100max
Payment & Shipping Terms:
Minimum Order Quantity: 1 set
Price: can negotiate
Packaging Details: Unicomp Wood.
Delivery Time: 15 days
Payment Terms: L/C, T/T
Supply Ability: 100set/montrh
Detailed Product Description
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PCB X-ray machine Unicomp AX9100MAX

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High Magnifications PCB X-ray Machine

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X-ray Machine For Electronics IC

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.

 

 

  • Application Fields

     

 

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  • Functions and Feature

     

 

 

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  • Inspection Image

     

     

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System Summary
Footprint 1450(W)×1680(D)×1850(H)mm
Machine Weight 2400 kg
Power Supply 220AC/50Hz
Packaging Dimension 1710(W)×1950(D)×1875(H)mm
Packing Weight 2600 kg
Power Consumption 3.5 kW
X-Ray Tube
Tube Type Type Sealed type
Max. Power Output 65W
Voltage 0~130kV (Adjustable)
Focus Spot Size ≤8μm
Imaging System
Detector High Resolution FPD
Pixel Size ≤85μm
Effective Detection Area 130*130mm
Frame Rates 20fps
Pixel 1536*1536
System Magnification 1600X
Software
One-click Zoom in & out Fast & Automatic navigation of ROI region
Fixed-point following during FPD tilting Table automatic following while Axis tilting seperately
Algorithms For Image Super-Resolution Reconstruction Intelligently improve the overall image clarity with one-click
Automatic images comparison Intelligently adjust overall image contrast with one-click
Variety of filter processing algorithms Sharpening, enhancement, color reversal, denoising image preprocessing functions
Motion Control System
Movement Control Method Dual Joystick, Keypad & Mouse
Max. Loading size Ф620mm
Max. Inspection size 600*450mm
Tilting Inspection Maximum 60°
Objective Stage Horizontal Rotation 360°
Industrial PC
Operating System Windows 10 64bit
Monitor(Dual) 27 "4K HD display
Hard disk 1TB
RAM 16G
CPU model Intel i7 Processor
Other Features
Door Open Manually
Safety Operation Electromagnetic Interlock, Warning Light and Real-time Radiation Leakage Monitor
Authority Management Fingerprint Access Management System, and Support Password Accessing
X-Ray Safety <1μSv/h (Meets All International Standards)

* Specifications are subject to change without notice, All trademarks are the property of the system maker.

 

 

 

 

  • Dimensions and Appearance

 

 

 

High Magnifications PCB X-ray Machine Unicomp AX9100MAX For Electronics IC Components Bonding Wire Inspection 3

Contact Details
Unicomp Technology

Contact Person: Mr. James Lee

Tel: +86-13502802495

Fax: +86-755-2665-0296

Send your inquiry directly to us (0 / 3000)