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Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

Certification
China Unicomp Technology certification
China Unicomp Technology certification
Customer Reviews
Stable product quality , reliable cooperation partner

—— Mr. Smith

Unicomp Techology is really impressive.

—— Selvam N

You are good and reliable supplier again thanks

—— Mr. Merlin Euphemia

The feedback we got from the unit we purchased is so far very good. The client is happy.

—— Mr. Nicholas

A professional service team Life-long free software upgrading Timely technical support

—— Ms Rein

We have visited Unicomp . It is big company in China . And their engineers are so professional .

—— Mr Okan

Scheduled call & visits Onsite installation, debugging and training services

—— Mrs Yulia

Nice work on the X-Ray machine!

—— Qusaay Albayati

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Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

Large Image :  Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

Product Details:
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX9100max
Document: AX9100MAX-Dual screen.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1 set
Price: can negotiate
Packaging Details: Unicomp Wood.
Delivery Time: 15 days
Payment Terms: L/C,T/T
Supply Ability: 100set/montrh
Detailed Product Description
Voltage: 130kV Movement Control: Mouse & Keyboard & Dual Joystick
Max. Loading Area: Φ620[mm] Max. Inspection Area: 450*600[mm]
Tilt And Rotation: Rotate The Swing Arm Up To 60° Table: Plane Rotation 360°
Highlight:

Unicomp AX9100max X Ray Machine

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Flip-Chip BGA X Ray Machine

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FCBGA electronics inspection machine

Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including:
  • BGA/CSP/Flip Chip packaging
  • LED & optoelectronic components
  • Fuse & diode manufacturing
  • PCB & semiconductor assembly
  • Battery production
  • Small metal castings
  • Electronic connector modules & cables
  • Photovoltaic (PV) cell inspection
Application Fields
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) 0
Application fields of Unicomp AX9100max X-ray Machine
Functions and Features
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) 1
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) 2
Sample inspection image from Unicomp AX9100max X-ray Machine
Technical Parameters and Specifications
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) 3
Technical specifications of Unicomp AX9100max X-ray Machine
Dimensions and Appearance
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) 4
Dimensions and appearance of Unicomp AX9100max X-ray Machine

Contact Details
Unicomp Technology

Contact Person: Mr. James Lee

Tel: +86-13502802495

Fax: +86-755-2665-0296

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