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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Large Image : Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Product Details:

Place of Origin:	China
Brand Name:	UNICOMP
Certification:	CE, FDA
Model Number:	AX9100max
Document:	AX9100MAX-Dual screen.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1 set
Price:	can negotiate
Packaging Details:	Unicomp Wood.
Delivery Time:	15 days
Payment Terms:	L/C,T/T
Supply Ability:	100set/montrh

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Detailed Product Description

Monitor:	27 "HD Display	System OS:	Windows10 64-bit
Hard Disk:	1TB	RAM:	16G
CPU Model:	I7
Highlight:	Unicomp AX9100max X-ray inspection system , Flip-Chip BGA X-ray machine , FCBGA packaging analysis equipment

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including:

BGA/CSP/Flip Chip packaging
LED & optoelectronic components
Fuse & diode manufacturing
PCB & semiconductor assembly
Battery production
Small metal castings
Electronic connector modules & cables
Photovoltaic (PV) cell inspection

Application Fields

Application fields of Unicomp AX9100max X-ray Machine

Functions and Features

Functions and features of Unicomp AX9100max X-ray Machine

Inspection Image

Sample inspection image from Unicomp AX9100max X-ray Machine

Technical Parameters and Specifications

Technical specifications of Unicomp AX9100max X-ray Machine

Dimensions and Appearance

Dimensions and appearance of Unicomp AX9100max X-ray Machine

Tag:

Contact Person: Mr. James Lee

Tel: +86-13502802495

Fax: +86-755-2665-0296

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Unicomp CX3000 Desktop Electronics X Ray Machine With Reel To Reel JEDEC Tray And Tube

Name: Electronics X Ray Machine

Application: SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor

X-ray Coverage: 48mm x 54mm

X-ray Leakage: < 1uSv/h

IC Curvature Measurement Unicomp AX9100MAX X-Ray Machine with 84μm Pixel Size and 60° Tilting Angle

X-ray Tube Type: sealed type

Pixel Size: 84μm

Pixel: 1536*1536

Footprint: 1455(W)×1760(D)×1945(H)mm

Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

Voltage: 130kV

Movement Control: Mouse & Keyboard & Dual joystick

Max. Loading Area: Φ620[mm]

Max. Inspection Area: 450*600[mm]

Unicomp AX9100max X-ray Machine For EV Cylindrical Cell

Power supply: 220AC/50Hz

Voltage: 130kV

Detector: Flat Panel Detector (FPD)

Unicomp AX9100max X-ray Machine For Cylindrical Power Cell

Power supply: 220AC/50Hz

Dimension: ≈1455(W)x1760(D)x1945(H)mm

Machine Weight: ≈2400kg

Voltage: 130kV



	Factory Address:Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen

	Sales office:Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen

	+86-755-8527-1589

	marketing@unicomp.cn

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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Unicomp AX9100max X-ray inspection system

Flip-Chip BGA X-ray machine

FCBGA packaging analysis equipment

x ray equipment,

electronics x ray system,

electronic inspection equipment

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