Unicomp AX8300H X-ray Inspection Machine with 110kV Microfocus X-ray Source and High Resolution FPD
Basic Properties
Place of Origin:
China
Brand Name:
UNICOMP
Certification:
CE, FDA
Model Number:
AX8300H
Trading Properties
Minimum Order Quantity:
1Set
Price:
can negotiate
Payment Terms:
T/T,L/C
Supply Ability:
300 sets per month
Product Summary
AX8300H X-ray inspection with 110kV microfocus source & 360° rotation. High-resolution FPD detection for BGA, CSP, semiconductor analysis. Meets FDA safety standards with <1μSv/h leakage.
Product Details
Highlight:
110kV Microfocus X-ray Source X-ray Inspection Machine
,360 Degree Rotating Table X-ray Detector
,High Resolution FPD X-ray System
Name:
X-ray Inspection Machine
Application:
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage:
110KV
X-Ray Leakage:
< 1uSv/h
Weight:
1605kg
Power Consumption:
1.2KW
Product Description
Unicomp X-Ray Detector AX8300H with 110kV Microfocus X-Ray Source and 360° Rotating Table
The AX-8300H X-ray Detector is engineered specifically for high-resolution PCBA inspection applications. This innovative system represents an industry first by utilizing a specialized 110kV microfocus x-ray source, providing the ideal energy solution when 90kV is insufficient and 130kV is excessive.
Featuring state-of-the-art Flat Panel Display (FPD) detection technology, the AX-8300H generates exceptionally high magnification and resolution images comparable to the finest 90kV x-ray tube systems. The 360° rotating table offers unlimited imaging perspectives for comprehensive inspection capabilities.
Key Features
- 110kV Microfocus X-ray Source
- High Resolution Flat Panel Detector (FPD)
- X/Y/Z/Tilt Motions (table, tube, FPD)
- 360° Table Rotation
- Angle View up to 70 Degrees
- Point and Click Location Navigation
- CNC Programming for Multiple Image Inspection Routines
- Maximum Inspection Area: 360 x 340mm
Applications
- BGA/CSP/Flip Chip: Bridging, Voids, Opens, Excessive/Insufficient Solder
- QFN: Bridging, Voids, Opens, Registration
- SMT Standard Components: QFP, SOT, SOIC, Chips, Connectors, Others
- Semiconductor: Bond Wire, Die Attach Void, Mold Void
- Multi-layer Board (MLB): Inner Layer Registration, Pad Stack, Blind/Buried Vias
Technical Specifications
| Model | AX8300H |
|---|---|
| Max kV/Type | 110 kV/Sealed |
| Max Electron Beam Power | 25W |
| Focal Spot Size | 5μm |
| System Magnification | Up to 1000X |
| Imaging System (Option) | Flat Panel Detector |
| Manipulator | 8-axis with tilt 50 degree |
| Measuring Volume | Max load area 300x300mm² |
| Max Sample Weight | 5kg |
| Monitors | 27" HD |
| Cabinet Dimensions | 1200x1400x1700mm |
| Weight | 1605kg |
| Radiation Safety | <1μSv/hr (<0.1mR/hr) at the cabinet surface 5cm |
| Control | Keyboard/Mouse/Joystick |
| Automated Inspection | Standard |
| Primary Applications | Chip inspection/Electronic components/Auto parts, etc. |
Note: Focal spot size is variable. Please consult Unicomp for specific requirements. All x-ray machines manufactured by Unicomp Technology meet FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems, with radiation emissions not exceeding 5 millirem/hr at 2" from any external surface.
Inspection Images
Overall Rating
5 star
100%
4 star
0
3 star
0
2 star
0
1 star
0
All Reviews
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Mgood machine
-
Pgood product
-
SStable product quality , reliable cooperation partner
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