High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System
Basic Properties
Place of Origin:
China
Brand Name:
UNICOMP
Certification:
CE, FDA
Model Number:
AX9100MAX
Trading Properties
Minimum Order Quantity:
1 set
Price:
can negotiate
Payment Terms:
L/C,T/T
Supply Ability:
30 sets per month
Product Summary
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of ...
Product Details
Highlight:
PCBA BGA solder test X-ray equipment
,SMT IC inspection X-ray machine
,high resolution X-ray equipment for PCBA
Machine Type:
Semiconductor Electronic X-Ray Inspection System
Model:
AX9100MAX
X-Ray Tube Type:
Sealed Type
Pixel Size:
84μm
Pixel:
1536*1536
Footprint:
1450(W)×1765(D)×1835(H)mm
Product Description
UNICOMP AX9100MAX X-Ray Inspection System
High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities.
System Overview
This advanced X-ray inspection system is designed for high-precision non-destructive testing of electronics IC components and bonding wire analysis. It is widely deployed across industrial and semiconductor applications for quality control and R&D verification.
Applications
BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, lithium battery assemblies, miniature precision metal castings, automotive electronic connector assemblies, wiring harnesses, and photovoltaic structural parts.
Key Advantages
- Large inspection stroke for comprehensive coverage
- Strong X-ray penetration capability
- Flexible multi-angle positioning
- Meets stringent quality control requirements for automotive electronics, new energy, photovoltaics, and high-density microelectronic manufacturing
System Specifications
| Footprint | 1450(W) × 1765(D) × 1835(H) mm |
| Machine Weight | 2400 kg |
| Power Supply | 220V ±10%, 50/60Hz, 8A |
| Packaging Dimension | 1750(W) × 2280(D) × 2100(H) mm |
| Packing Weight | 2600 kg |
| Power Consumption | 1.8 kW |
X-Ray Tube Specifications
| Tube Type | Sealed type |
| Max. Power Output | 65W |
| Voltage | 130kV |
| Focus Spot Size | ≤7μm |
Imaging System
| Detector | High Resolution FPD |
| Pixel Size | 84μm |
| Effective Detection Area | 129 × 129 mm |
| Frame Rates | 30fps |
| Pixel Matrix | 1536 × 1536 |
| System Magnification | 1600X |
Software Features
- One-click zoom in & out with fast automatic navigation of ROI region
- Fixed-point following during FPD tilting
- Table automatic following while axis tilting separately
- Algorithms for image super-resolution reconstruction
- Intelligently improve overall image clarity with one-click
- Automatic images comparison
- Intelligently adjust overall image contrast with one-click
- Variety of filter processing algorithms including sharpening, enhancement, color reversal, and denoising image preprocessing functions
Motion Control System
| Movement Control Method | Dual Joystick, Keypad & Mouse |
| Max. Loading Size | Ф620mm |
| Max. Inspection Size | Ф500mm |
| Tilting Inspection | Maximum 60° (Tube & Detector) |
| Objective Stage | Horizontal Rotation 360° |
Industrial PC Configuration
| Monitor (Dual) | 27" 4K HD display |
| Operating System | Windows 10 64bit |
| Hard Disk | 1TB |
| RAM | 16G |
| CPU Model | Intel i7 Processor |
Safety & Security Features
- Hand-operated door with electromagnetic interlock
- Warning light and real-time radiation leakage monitor
- Fingerprint access management system with password access support
- X-Ray safety: <1μSv/h (Meets all international standards)
System Dimensions and Appearance
UNICOMP AX9100MAX X-Ray Machine dimensions and external appearance
Functions and Features
UNICOMP AX9100MAX X-Ray Machine functional features and capabilities
Sample Inspection Image
Sample inspection image showing high magnification PCB component analysis
Specifications are subject to change without notice. All trademarks are the property of the system maker.
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