High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp
Basic Properties
Place of Origin:
China
Brand Name:
UNICOMP
Certification:
CE, FDA
Model Number:
AX9500
Trading Properties
Minimum Order Quantity:
1Set
Price:
can negotiate
Payment Terms:
T/T,L/C
Supply Ability:
300 sets per month
Product Summary
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and ...
Product Details
Highlight:
FPD SMT X-ray inspection machine
,BGA packaging X-ray machine
,Unicomp AX9500 X-ray inspection
Name:
Unicomp X-ray Inspection Machine
Application:
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Industry:
Electronics Industry
X-Ray Leakage:
< 1uSv/h
Product Description
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp
The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, while also supporting SMT welding analysis with advanced 3D tomography CT scanning technology (planar CT + cone beam CT).
Applications
- Semiconductor industry
- SMT manufacturing
- Photovoltaic components
- Ceramic products
- Automotive parts inspection
- Aluminum die-casting mold castings
- Molded plastic parts
System Specifications
| Parameter | Specification |
|---|---|
| Footprint | 1580(W) × 1860(D) × 2000(H) mm |
| Machine Weight | ≈3750 kg |
| Power | 4.5 kW |
| Max. Voltage | 160 kV |
| X-Ray Leakage | <0.5 μSv/h |
Imaging System
| Parameter | Specification |
|---|---|
| Tube Type | Open tube |
| Resolution | 1 μm (Optional 0.5 μm) |
| Detector | FPD |
| System Magnification | 2000X |
Inspection Area
| Parameter | Specification |
|---|---|
| Max. Inspection Dimension | 610 × 540 mm |
| Max. Load Dimension | 610 × 580 mm |
| Max. Inspection Area (3D) | Planar 3D: 450(X) × 450(Y) mm Cone-beam 3D: 50(D) × 150(L) mm |
| Motion Control Mode | Joystick Mouse & Keyboard |
| Detector Angle | 360° full viewing angle, 2 × 70 degree tilt |
X-Ray Inspection Sample
* Specifications are subject to change without notice. All trademarks are the property of the system maker.
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