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Multi‑mode 3D Reconstruction PCBA BGA Solder Joint X‑ray Inspection Machine AX9500 Unicomp Inspection Tester

Basic Properties
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX9500
Trading Properties
Minimum Order Quantity: 1Set
Price: can negotiate
Payment Terms: T/T,L/C
Supply Ability: 300 sets per month
Product Summary
Multi-mode 3D Reconstruction PCBA BGA Solder Joint X-ray Inspection Machine AX9500 Unicomp Inspection Tester High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Product Overview Fully upgraded new products featuring advanced CT detection ...

Product Details

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Multi-mode 3D X-ray inspection machine

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BGA solder joint X-ray tester

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PCBA X-ray inspection machine with warranty

Name: Unicomp X-ray Inspection Machine
Application: SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Industry: Electronics Industry
X-Ray Leakage: < 1uSv/h
Product Description
Multi-mode 3D Reconstruction PCBA BGA Solder Joint X-ray Inspection Machine AX9500 Unicomp Inspection Tester
High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection
Product Overview
Fully upgraded new products featuring advanced CT detection capabilities for BGA, CSP, flip chips, LEDs and other semiconductors. Ideal for SMT welding analysis with comprehensive 3D tomography CT scanning system (planar CT + cone beam CT).
Applications
  • Semiconductor industry
  • SMT manufacturing
  • Photovoltaic components
  • Ceramic products and special industries
  • Automotive parts inspection
  • Aluminum die-casting mold castings
  • Molded plastic parts analysis
System Specifications
System Summary
Footprint 1580(W) × 1860(D) × 2000(H) mm
Machine Weight ≈3750 kg
Power 4.5 kW
Max. Voltage 160 kV
X-Ray Leakage <0.5 μSv/h
Imaging System
Tube Type Open tube
Resolution 1 μm (Optional 0.5 μm)
Detector FPD
System Magnification 2000X
Inspection Area
Max. Inspection Dimension 610 × 540 mm
Max. Load Dimension 610 × 580 mm
Max. Inspection Area (3D) Planer 3D: 450(X) × 450(Y) mm
Cone-beam 3D: 50(D) mm × 150(L) mm
Motion Control Mode Joystick Mouse & Keyboard
Detector Angle 360° full viewing angle, 2 × 70 degree tilt
X-Ray Inspection Sample
AX9500 UNICOMP X-Ray Inspection Machine sample image showing detailed PCB and BGA inspection capabilities
* Specifications are subject to change without notice. All trademarks are the property of the system maker.
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