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See What’s Hidden Inside Mini LEDs — Bubbles Revealed by X-Ray

Basic Properties
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX8300MAX
Trading Properties
Minimum Order Quantity: 1Set
Price: can negotiate
Payment Terms: T/T,L/C
Supply Ability: 30 sets per month
Product Summary
Advanced X-Ray Inspection System with Automated Void Analysis Discover hidden internal structures in mini LEDs with our advanced X-ray inspection system featuring Unicomp Auto Void Analysis. This comprehensive semiconductor and electronics testing solution includes 60° tilt and 360° rotary stage ...

Product Details

Highlight:

mini LED X-ray machine

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X-ray machine for bubbles

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electronics X-ray inspection

Motion Control Mode: Mouse & Keyboard & Joystick
Tilt And Rotation: Detector Unilateral Tilt Maximum 60°
Monitor: 27"HD 4K Display
System OS: Windows11 64-bit
Power Consumption: 900W
Product Description
Advanced X-Ray Inspection System with Automated Void Analysis
Discover hidden internal structures in mini LEDs with our advanced X-ray inspection system featuring Unicomp Auto Void Analysis. This comprehensive semiconductor and electronics testing solution includes 60° tilt and 360° rotary stage capabilities for detailed BGA and HIP (Head-In-Pillow) inspection.
Applications
This versatile system serves multiple industries including semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive components, new energy industry parts, aluminum die castings, injection molded plastics, ceramic products, and various specialized industrial components.
Key Features
  • Professional semiconductor inspection configuration with 5 μm ultra-high resolution
  • Extended detection scope supporting high-efficiency batch inspection and mass production testing
  • Dual rocker mechanical design for flexible and precise manual operation
  • Compatible with 2D and 2.5D detection with expandable 3D detection function
  • Dual-screen interactive design supporting multi-task parallel operation
  • Integrated dedicated AI algorithm for automated semiconductor defect detection
Technical Specifications
Product Name AX8300MAX
Dimension 1286(W)*1540(D)*1700(H)[mm]
Machine Weight 1530kg
Power Supply 220V±10% 50Hz/60Hz 4A
Detector High resolution FPD
Voltage 110kV
Power 900w
Tube Type Sealed
Max. Power 20W
Detection Area 129*129[mm]
Pixel Matrix 1536*1536[pixel]
Frame Rates Max 30fps
Geometric Magnification 47.7X
System Functions
AX8300MAX X-ray inspection machine system functions and interface display
Inspection Sample Images
Sample X-ray inspection images showing BGA solder joint analysis
Frequently Asked Questions
How about the package? Is it safe during delivery?
All X-ray inspection machines are packed with standard wooden solid cartons to ensure safe shipping and delivery.
Do you provide warranty? How about the after-sales service?
We provide 1-year warranty free for spare parts with lifetime technical support. Our professional after-sales team offers assistant videos for troubleshooting.
If we come to your factory, will you provide free training?
Yes, we warmly welcome you to visit our factory and will arrange comprehensive free training for your team.
Our Services
  • Help customers analyze product projects and provide detection solutions
  • Provide professional detection solutions
  • Skilled jig design services
  • 24-hour feedback speed by email and other channels
  • Free sample detection testing
  • Provide shipping/delivery information checking service
  • One year guarantee with lifetime maintenance promise
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