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Fingerprint Access 30fps X-Ray for PCB Connector Cable Button Cell Battery MOS LED Testing AX7900 UNICOMP

Basic Properties
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX7900
Trading Properties
Minimum Order Quantity: 1Set
Price: can negotiate
Payment Terms: T/T,L/C
Supply Ability: 300 sets per month
Product Summary
The UNICOMP AX7900 is a high-precision X-ray inspection system engineered for printed circuit board analysis, delivering advanced imaging capabilities and European engineering standards. It is purpose-built for PCB connector, cable, button cell battery, MOS, and LED testing with reliable, repeatable ...

Product Details

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AX7900 X-Ray PCB Testing

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30fps X-Ray Cable Inspection

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UNICOMP X-Ray Battery Testing

Name: Unicomp X-ray Inspection Machine
Application: SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage: 90KV
Industry: Electronics Industry
Size: 1215(L)x1325(W)x1700(H)mm
X-Ray Leakage: < 1uSv/h
Weight: 1240kg
Power Consumption: 0.8KW
Product Description

The UNICOMP AX7900 is a high-precision X-ray inspection system engineered for printed circuit board analysis, delivering advanced imaging capabilities and European engineering standards. It is purpose-built for PCB connector, cable, button cell battery, MOS, and LED testing with reliable, repeatable results.

System Overview

The AX7900 combines a 90KV 5μm X-ray tube with an FPD detector, a multi-function workstation, and a comprehensive motion control system. It offers optional ±60° tilt ("Arc") motion and Z-axis movement for precise magnification and field-of-view adjustment, enabling detailed inspection of densely populated boards and small components.

Key Features
  • 90KV 5μm X-ray tube paired with an FPD detector
  • Multi-function workstation with X-Y multi-axis movement
  • Optional ±60° "Arc" tilt motion
  • Motion controls: X/Y table motion plus Z-axis tube and detector movement
  • Multi-function DXI image processing system
  • X/Y programming function for automated multi-image inspection routines
  • Maximum loading area: 600mm x 520mm
  • Maximum detection area: 505mm x 440mm
  • Approximately 52X geometric magnification
  • BGA void/area auto-measurement with report generation
Applications

Suitable for LED, SMT, BGA, CSP, and Flip Chip inspection, as well as semiconductor, packaging components, battery industry, electronic components, auto parts, photovoltaic industry, aluminum die casting, moulding plastic, ceramics, and other specialized industrial inspection applications.

Technical Specifications
Item Definition Specifications
System Parameters Size 1215 (L) x 1325 (W) x 1700 (H) mm
Weight 1240 kg
Power 220AC / 50Hz
Power Consumption 0.8 kW
X-ray Tube Type Closed
Max. Voltage 90 kV
Max. Power 8 W
Spot Size 5 μm
X-ray System Intensifier FPD
Monitor 24" LCD
Geometric Magnification 52X
Detection Region Max. Loading Size 600mm x 520mm
Max. Inspection Area 505mm x 440mm
X-ray Leakage <1 μSv/h
Inspection Images
UNICOMP AX7900 X-ray inspection sample showing high-resolution PCB component analysis
High-resolution PCB component analysis captured by the UNICOMP AX7900 X-ray inspection system.
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