UNICOMP AX7900 5μm High Resolution 84μm Pixel FPD Detector Automatic Defect Detection BGA IC
Basic Properties
Place of Origin:
China
Brand Name:
UNICOMP
Certification:
CE, FDA
Model Number:
AX7900
Trading Properties
Minimum Order Quantity:
1Set
Price:
can negotiate
Payment Terms:
T/T,L/C
Supply Ability:
300 sets per month
Product Summary
UNICOMP AX7900 5μm High-Resolution FPD X-Ray Inspection System for BGA and IC Defect Detection The UNICOMP AX7900 is a high-precision X-ray inspection system engineered for printed circuit board analysis, delivering advanced imaging capabilities and European engineering standards. It is purpose...
Product Details
Highlight:
AX7900 FPD Detector 5μm resolution
,84μm pixel FPD BGA inspection
,Automatic defect detection X-ray detector
Name:
Unicomp X-ray Inspection Machine
Application:
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage:
90KV
Industry:
Electronics Industry
Size:
1215(L)x1325(W)x1700(H)mm
X-Ray Leakage:
< 1uSv/h
Weight:
1240kg
Power Consumption:
0.8KW
Product Description
UNICOMP AX7900 5μm High-Resolution FPD X-Ray Inspection System for BGA and IC Defect Detection
The UNICOMP AX7900 is a high-precision X-ray inspection system engineered for printed circuit board analysis, delivering advanced imaging capabilities and European engineering standards. It is purpose-built for PCB connector, cable, button cell battery, MOS, and LED testing with reliable, repeatable results.
System Overview
The AX7900 combines a 90KV 5μm X-ray tube with an FPD detector, a multi-function workstation, and a comprehensive motion control system. It offers optional ±60° tilt ("Arc") motion and Z-axis movement for precise magnification and field-of-view adjustment, enabling detailed inspection of densely populated boards and small components.
Key Features
- 90KV 5μm X-ray tube paired with an FPD detector
- Multi-function workstation with X-Y multi-axis movement
- Optional ±60° "Arc" tilt motion
- Motion controls: X/Y table motion plus Z-axis tube and detector movement
- Multi-function DXI image processing system
- X/Y programming function for automated multi-image inspection routines
- Maximum loading area: 600mm x 520mm
- Maximum detection area: 505mm x 440mm
- Approximately 52X geometric magnification
- BGA void/area auto-measurement with report generation
Applications
Suitable for LED, SMT, BGA, CSP, and Flip Chip inspection, as well as semiconductor, packaging components, battery industry, electronic components, auto parts, photovoltaic industry, aluminum die casting, moulding plastic, ceramics, and other specialized industrial inspection applications.
Technical Specifications
| Item | Definition | Specifications |
|---|---|---|
| System Parameters | Size | 1215 (L) x 1325 (W) x 1700 (H) mm |
| Weight | 1240 kg | |
| Power | 220AC / 50Hz | |
| Power Consumption | 0.8 kW | |
| X-ray Tube | Type | Closed |
| Max. Voltage | 90 kV | |
| Max. Power | 8 W | |
| Spot Size | 5 μm | |
| X-ray System | Intensifier | FPD |
| Monitor | 24" LCD | |
| Geometric Magnification | 52X | |
| Detection Region | Max. Loading Size | 600mm x 520mm |
| Max. Inspection Area | 505mm x 440mm | |
| X-ray Leakage | <1 μSv/h |
Inspection Images
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