bga x ray machine
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SMT BGA X Ray Inspection System
BGA X Ray Inspection Machine with integrated generator for SMT Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 80kV/90kV Max.Power 12W/8W Spot Size 5m/15m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 160 X/360X Detection Region Max.Loading Size 440mm x 400mm Max.Inspection Area 420mm x 380mm X-ray Leakage
Proprietary 80 / 90 KV Source Unicomp X-Ray Machine With Submicron Focal Spot Size
Proprietary 80 / 90 kV source with submicron focal spot size X Ray Machine FEATURES: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. 60 "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, 60 tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm, max. detection area 380 x
UNICOMP Metal X Ray Machine For BGA Connectivity And Analysis AX9100
Metal X Ray Machine for BGA connectivity and analysis AX9100 Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 1600 X Detection Region Max.Loading Size 570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
Unicomp AX9100 X Ray Machine SMT PCBA BGA LED QFN Soldering Void Measurement
SMT PCBA BGA LED QFN Soldering void measurement by Unicomp AX9100 X Ray Machine Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image.
AX7900 Real Time Digital X Ray Machine For Switch Inner Defects Inspection
Real Time Digital X-Ray Machine AX7900 for Switch Inner Defects Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz
AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection
AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
AX7900 Real Time Auto Offline X Ray Machine For Electronics Inner Defect Inspection
AX7900 Real Time Auto-Offline X Ray Machine For Electronics Inner Defect Inspection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power
Real Time Digital X Ray Machine AX7900 For PCBA Inner Defects Inspection
Unicomp factory supply quality control X-ray inspection machine for SMT industry APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
Real Time Digital X-Ray Machine AX7900 For Chip Inner Defects Inspection
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
