bga x ray machine
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High Performace X-ray Machine AX9100 for SMT PTH soldering filling rate and BGA Void inspection
High Performace X-ray Machine AX9100 for SMT PTH soldering filling rate and BGA Void inspection Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging
AC 110~220V Bga Inspection Equipment Hi Resolution FPD Detector For SMT Industrial
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor, Packaging components, Battery Industry, Features Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing system, CNC programmable detection X-ray tube & detector automatic lifting and descending, with convenient
China X-ray machines manfuacturer Unicomp microfocus 130kV X-ray AX9100 with 2.5D FPD oblique view for PCBA IC BGA PTH
China X-ray machines manfuacturer Unicomp microfocus 130kV X-ray AX9100 with 2.5D FPD oblique view for PCBA IC BGA PTH Features of X-ray AX9100: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications of X-ray AX9100: SMT, BGA, CSP,
Semiconductor High Resolution Welding X Ray Machine 90KV 5um
90kV 5um High Resolution And Long Lifespan X-Ray Machine For SMD PCBA Soldering Qualtiy Inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and
SMT BGA Soldering Void Measurement X-Ray Machine Microfocus 130kV
130kV 7 m Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Features: 1000X magnification, high-definition real-time image. 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. One
CSP AX8200 Electronics X Ray Machine 100KV For Solar Cell Soldering
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
CSP Electronics X Ray Machine UNICOMP CX3000 For Cable Connector
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high
AX9100 Unicomp X Ray Machine 130kV Close Tube For PCBA BGA QFN Soldering Void Check
130kV maintenance free close tube X-ray machine Unicomp AX9100 For PCBA BGA QFN soldering Void check Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 1600 X Detection Region Max.Loading Size 570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
Unicomp X Ray BGA Inspection Equipment
High-quality PCB inspection system BGA X Ray Inspection Machine X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. 7 axis linkage, 70