bga x ray machine
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Unicomp AX8200B Button Lithium Battery X Ray Machine 5um Focu Size 90kV Sealed Tube
Unicomp 5um 90kV sealed tube X-Ray Inspection Machine AX8200B for button Lithium battery inspection Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process
Unicomp AX8200 with FPD 100kv Pcb X Ray Machine for PCBA Quality Testing
Unicomp AX8200 automated smt pcb xray machine for computer motherboard repair The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Lithium Battery Electronics X Ray Machine Unicomp AX8200B
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
Unicomp AX8200 Electronics X Ray Machine Closed Tube Cable Harness Connectors
Cable Harness Connectors Quality Inspection by Unicomp AX8200 Microfocs X-ray with high resolution FPD Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing
Capacitor Inner Defect Electronics BGA X Ray Inspection System Auto Measuring
Capacitor Inner Defect Inspection with Electronics X-ray 100 KV Power AX8200MAX Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24 FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic
CCD Camera BGA QFN DFN Electronics X Ray Machine
Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 m Motion range (Up and Down) 150mm Magnification 600X Detector FPD Active Area: 130mm*130mm Resolution 58 LP/cm Camera 2 Mega Pixel CCD Motion range (Up and Down) 290mm
BGA Viods Wiring Bonds 1kW 90KV Digital X Ray Machine
Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 m Motion range (Up and Down) 150mm Magnification 600X Detector FPD Active Area: 130mm*130mm Resolution 58 LP/cm Camera 2 Mega Pixel CCD Motion range (Up and Down) 290mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22 LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area
130KV Micron Focus Spot Size Tube X-ray Machine AX9100MAX With Dual Computers For PCB&BGA Inspection
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)1680(D)1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Electronic Boards 2D & 2.5D X-ray Machine AX9100MAX With 360 Degrees Rotation Table For BGA&PCB
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)1680(D)1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
