bga x ray machine
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130KV Micron Focus Spot Size Tube X-Ray Machine Unicomp AX9100 Upgraded Model AX9100MAX With Dual Computers For PCB&BGA Inspection
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)1760(D)1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight 2600 kg Power Consumption 4
High Performance BGA X Ray Security Scanner 40AWG Photodiode X Ray Detector
Metro Museum Expo Center Security X-Ray Scanner Machine UNX6040E The UNX Series X-ray security detection machine release is a dynamic project associated with our Unicomp Technology Research and Development Manufacturing Division. Our full range of security machines are designed to address multiple safety requirements including internal detection of luggage, backpacks and express courier packages. The UNX Series machines are also effective for port logistics transportation,
5KW AX8800 Stand Alone X Ray Machine 100kv For Plate Aligenment
Cabinet Lithium Battery Automatic X-ray Inspection Machine AX8800 Features: Off-line lithium battery detection equipment 100KV 5m closed X-ray tube, Hi-resolution detector X-ray tube and detector can be programmed to move to Z Axis Automatic control of all the moving parts, Automatic programming Convenient target point positioning system Automation software judgments detection Applications: Lithium battery pole piece solder joint defect detection, Lithium
Offline Lithium Battery X Ray Machine 100kv AX8800 ISO9001
Cabinet Lithium Battery Automatic X-ray Inspection Machine AX8800 Applications: Lithium battery pole piece solder joint defect detection, Lithium battery batteries coiling case detection, BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry , Other Special Industries. Aftersales service: A professional service team Country-wide network 24/7 hotline
Unicomp AX8200max FPD Detector X Ray Machine For EMS SMT PCBA QFP
CHINA Leading X-ray manufacturer Unicomp AX8200max machine for EMS SMT PCBA QFP IC SOT package reflow Soldering Void Inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24 FHD Interactive Touch LCD Display 3
Unicomp AX8200Max X Ray Machine 6 Axis Manipulator For CNC Programmable Inspection
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24 FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60 Tilting Inspection 5.Fingerprint Access Management System 6
SMT PCB X-ray Machine Micron Focus Spot Size For BGA Voids Measurement And Solder Past Climbing Height Inspection
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)1680(D)1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
SMT PCB X-Ray Machine Unicomp AX9100MAX High Resolution Micron Focus Spot Size for BGA Voids and Solder Paste Inspection
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)1760(D)1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight 2600 kg Power Consumption
High Specifications Electronic Boards 2D & 2.5D X-Ray Machine Unicomp AX9100MAX With 360 Degrees Rotation Table For BGA And PCB Inspection
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)1760(D)1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight
