bga x ray machine
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Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection
Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection Description: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
Unicomp AX8200MAX X Ray Inspection Equipment For Semiconductor
Unicomp AX8200 X Ray Inspection Equipment For Semiconductor Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)1500(D)1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)155(D)200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable)
4-Axis Manipulator X-Ray Scanning Machine Unicomp AX8200B For Lithium Battery Cathod
AX8200B X-Ray machine for cylindrical lithium battery CNC programmable inspection with auto measurement Features: 100KV 5m X-ray tube, image intensifier with 2 mega pixels CCD camera. Motion controls include: 60 tilt motion, X/Y table motion plus Z axis tube and detector movement. Multi-function DXI image processing system X/Y programming function for multiple image inspection routines Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X
CE Computer Motherboard Chipset X Ray Inspection Machine AX9100
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection.
Z Axis Unicomp X Ray 0.8KW FPD Detector For Auto Parts
Using Unicomp X-ray inspection machine for medical indwelling needle inside quality measurement Description: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
Unicomp X-ray System AX8200max With Multiple Measuring Tools
Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)1500(D)1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)155(D)200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector
100KV Inline X Ray ADR Detection System BGA EMS For Inside Quality Inspection
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: Real-time image. 1000X system magnification. 100KV 5m X-Ray tube. Modular design with In-line expansibility. Economical and Practical. FPD Detector. 6 axis linkage system. X-ray tube and FPD simultaneously tilt 35. Applications: LED,SMT,BGA,CSP,Flip Chip Inspection. Semiconductor,Packaging components,Battery Industry. Electronic components, Auto parts, Photovolta
CNC Programming X Ray Detector Automatic For PCBA BGA CSP QFN
Automatic Measurement With CNC Programming X-Ray Equipment For PCBA BGA CSP QFN Reflow Soldering Quality Inspection Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Test Images: Features: 1000X magnification, high-definition real-time image. 90-130KV 5m X-Ray tube.
Real Time Unicomp X Ray 1.6kW AX9100 For Electronics Assembly
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power