industrial inspection systems
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Industrial NDT X Ray Machine UNC160 Internal Defect Inspection For Metal Products
Industrial NDT X-Ray inspection machine UNC160 specialized in internal defect inspection for Metal products Applications of NDT X-ray Machine UNC160: Cast parts and Pressure Vessels Steel pipe, Cylinder, and Wood Epoxy Resin Defect Detection Wheel, Tires, and Metal parts FAQ: 1. How about the package? Is it safe during the delivery? All X-ray inspection machine is packed with standard wooden solid carton. It is safe when shipping. 2. Do you provide the Warranty? How
CE/FDA Certificated FPD 90KV X-ray Inspection System for Capacitor Defects Detecting
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, PCB, Flip Chip, LED, Fuse, Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
Accurate X-Ray Inspection for PCB Control X-ray Leakage 1uSv/h Voltage 0-110kV Adjustable
X-Ray Inspection for PCB Quality Control Application of SMT X-Ray machine Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of Desktop X-ray machine Large Size Inspection Table with 360 rotation Laser Locator for Precise Location Maganification (1000X) Accurate Control, CNC Programming Automatic Positioning FPD 55
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment Product Overview The Unicomp AX9100 represents advanced X-ray inspection technology for comprehensive SMT assembly quality control, featuring high-definition 2.5D imaging and specialized void detection capabilities for BGA components. Key Features 130KV 7m X-Ray tube for precise imaging High-speed, high-resolution FPD with millions of pixels 1000X magnification with high
Omni-directional Bond Wire Inspection IC X-ray AX9100 UNICOMP Precision Component Testing Machine
Omni-directional Bond Wire Inspection IC X-ray AX9100 UNICOMP Precision Component Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7m X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with
0.2mm High sensitivity Unicomp UNX6030 X ray inspection machine for beaf chiken and meat
UNX6030-N X-ray Inspection Machine The UNX6030-N is a compact X-ray inspection system specifically engineered for lightweight, small-bag packaged products. Optimized with advanced detection algorithms for low-density and thin-layer materials, this model excels at identifying and rejecting physical contaminants that traditional metal detectors often miss. Core Application Areas Confectionery & Snacks: Chocolates, hard/soft candies, biscuits, baked bread, and extruded potato
High magnifications PCB X-ray machine Unicomp AX9100MAX for electronics IC components bonding wire inspection
High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery
Electronics SMT BGA X-Ray Inspection System 130KV CSP LED AX9100 , 1900kg
Electronics SMT BGA X-ray Detection Equipment 130KV CSP LED AX9100 Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. 7 axis linkage, 70 degree tilt detection. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry.
AC 110~220V Bga Inspection Equipment Hi Resolution FPD Detector For SMT Industrial
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor, Packaging components, Battery Industry, Features Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing system, CNC programmable detection X-ray tube & detector automatic lifting and descending, with convenient
