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IHDR Algorithm Enhanced BGA & PCBA X-ray Inspection UNICOMP AX8300 Ultra-Clear Defect Visualization
IHDR Algorithm Enhanced BGA & PCBA X-ray Inspection UNICOMP AX8300 Ultra-Clear Defect Visualization The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the ...
110KV High-Resolution X-ray Unicomp AX8300 for Non-Destructive BGA Solder Joint Analysis
High Resolution Semiconductor X-Ray Inspection Machine AX8300 AX8300 adopts self-developed 110kV high-power micro-focus X-ray source with ultra-fine 2μm resolution. It supports 60° tilting & 360° rotating 2.5D omni-directional non-blind inspection, clearly identifying tiny internal defects of chips ...
SMD Cable X Ray System , Pcb Inspection Equipment AX8300 For Electronics Components
SMD Cable Electronics Components Unicomp PCB X Ray Machine AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ...
High Accuracy Internal Defect Scan Lithium Battery Safety Inspection Battery X-ray AX9600 Unicomp New Energy Testing Instrument
High Accuracy Internal Defect Scan Lithium Battery Safety Inspection Battery X-ray AX9600 Unicomp New Energy Testing Instrument Product Positioning: AX9600 is Unicomp Technology's most sophisticated semiconductor X-ray inspection equipment. Its core value lies in being equipped with the self...
High-Precision BGA QFN X-ray AX8300 UNICOMP 5μm Min Resolution Flat Panel Detector
High-Precision BGA QFN X-ray AX8300 UNICOMP 5μm Min Resolution Flat Panel Detector The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro...
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...
Bubble Ratio Measurement SMT Electronic BGA Component Inspection X-ray AX8300 UNICOMP
Bubble Ratio Measurement SMT Electronic BGA Component Inspection X-ray AX8300 UNICOMP The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...
BGA Void Bridging Missing Ball Detection X-ray AX8300 UNICOMP Real-Time Safety Monitoring
BGA Void Bridging Missing Ball Detection X-ray AX8300 UNICOMP Real-Time Safety Monitoring The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...
110kV Sealed Tube 50° Tilt X-ray Detector AX8300 Unicomp Crimp Joint Void Inspection Equipment
AX8300 110kV Sealed Tube X-ray Inspection System The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly ...
