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Quality Flawer Detector X Ray Inspection System 0.8kW BGA For Vehicle LED Lamp factory

Flawer Detector X Ray Inspection System 0.8kW BGA For Vehicle LED Lamp

EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

Quality Vehicle LED Lighting X Ray Inspection Machine 0.8kW For Soldering Quality Checking factory

Vehicle LED Lighting X Ray Inspection Machine 0.8kW For Soldering Quality Checking

EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

Quality Advanced X-Ray Inspection Equipment for Electronics Industry 1000kg Maximum Load factory

Advanced X-Ray Inspection Equipment for Electronics Industry 1000kg Maximum Load

X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: Large Size Inspection Table,Laser Pinpoint For Precise Location Accurate Control, CNC Programming,Automatic Positioning FPD Tilting 25 Safely Electromag

Quality Industry Electronics Industry X-Ray Inspection Equipment for Wire 1280x1220x1615mm factory

Industry Electronics Industry X-Ray Inspection Equipment for Wire 1280x1220x1615mm

X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Large-Scale Inspection Table with Laser Pinpointing for Precise Localization High-Precision

Quality FPD Detector Bga X Ray Inspection System for Multi - Functional Workstation factory

FPD Detector Bga X Ray Inspection System for Multi - Functional Workstation

BGA X Ray Inspection Machine high-quality PCB inspection system X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Installation Unicomp will provide installation and calibration service at the customers

Quality Long Life BGA X Ray Inspection Machine , X Ray Imaging System 4"Image Intensifier factory

Long Life BGA X Ray Inspection Machine , X Ray Imaging System 4"Image Intensifier

BGA electronic parts X-ray Inspection Machine with high quality X-ray images Features: 100KV 5m X-ray tube, image intensifier with 2 mega pixels CCD camera. Motion controls include: 60 tilt motion, X/Y table motion plus Z axis tube and detector movement. Multi-function DXI image processing system X/Y programming function for multiple image inspection routines Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X System Magnification.

Quality Unicomp AX8500 X Ray Inspection Machine For SMT EMS BGA LED CSP QFN Soldering factory

Unicomp AX8500 X Ray Inspection Machine For SMT EMS BGA LED CSP QFN Soldering

Unicomp AX8500 X-ray inspection machine for SMT / EMS BGA LED CSP QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector

Quality CX3000 Desktop Electronics PCB X Ray Machine for BGA and CSP inspection factory

CX3000 Desktop Electronics PCB X Ray Machine for BGA and CSP inspection

CX3000 Benchtop Electronics PCBA Unicomp X-ray Detection Equipment Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200A Spot Size 5m Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360 rotary fixture (Optional) X-ray Leakage

Quality High Resolution 90kV Benchtop PCB X-Ray Machine Unicomp AX7900 For Electronic Components factory

High Resolution 90kV Benchtop PCB X-Ray Machine Unicomp AX7900 For Electronic Components

5 m Micro focus X-Ray machines Unicomp AX7900 for semicon IC components wire bonding testing Description of AX7900 : 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.